Inventor
KOMAI NAOKI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “KOMAI NAOKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
21 patentsUS6846227B2Jan 25, 2005
Electro-chemical machining appartus
SONY CORP81 citations97
US6380065B1Apr 30, 2002
Interconnection structure and fabrication process therefor
SONY CORP69 citations96
US8034704B2Oct 11, 2011
Method for manufacturing semiconductor device and semiconductor device
SONY CORP27 citations92
US6797623B2Sep 28, 2004
Methods of producing and polishing semiconductor device and polishing apparatus
SONY CORP30 citations92
US6709979B2Mar 23, 2004
Method of manufacturing a semiconductor device
SONY CORP21 citations92
US6534117B1Mar 18, 2003
Electroless plating method and electroless plating solution
SONY CORP32 citations92
US6479384B2Nov 12, 2002
Process for fabricating a semiconductor device
SONY CORP47 citations92
US9379006B2Jun 28, 2016
Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
SONY CORP5 citations84
US6878632B2Apr 12, 2005
Semiconductor device having a conductive layer with a cobalt tungsten phosphorus coating and a manufacturing method thereof
SONY CORP17 citations84
US6809029B2Oct 26, 2004
Semiconductor production device and production method for semiconductor device
SONY CORP14 citations84
US6524429B1Feb 25, 2003
Method of forming buried wiring, and apparatus for processing substratum
SONY CORP14 citations84
US7186322B2Mar 6, 2007
Methods of producing and polishing semiconductor device and polishing apparatus
SONY CORP14 citations83
US6465342B1Oct 15, 2002
Semiconductor device and its manufacturing method
SONY CORP7 citations74
US10986281B2Apr 20, 2021
Pinhole camera, electronic apparatus and manufacturing method
SONY CORP2 citations73
US6602787B2Aug 5, 2003
Method for fabricating semiconductor devices
SONY CORP9 citations73
US7851236B2Dec 14, 2010
Film thickness prediction method, layout design method, mask pattern design method of exposure mask, and fabrication method of semiconductor integrated circuit
SONY CORP2 citations63
US11924557B2Mar 5, 2024
Pinhole camera, electronic apparatus and manufacturing method
SONY CORP0 citations62
US6736699B2May 18, 2004
Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
SONY CORP5 citations62
US7141501B2Nov 28, 2006
Polishing method, polishing apparatus, and method of manufacturing semiconductor device
SONY CORP0 citations52
US6777321B2Aug 17, 2004
Method of forming buried wiring
SONY CORP0 citations52
US7033943B2Apr 25, 2006
Etching solution, etching method and method for manufacturing semiconductor device
SONY CORP0 citations51
SONY SEMICONDUCTOR SOLUTIONS CORP
4 patentsUS11614606B2Mar 28, 2023
Camera module, method of manufacturing the same, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations73
US12230662B2Feb 18, 2025
Backside-illumination solid-state image pickup apparatus, image pickup apparatus, and electronic equipment including embedment members
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US12349482B2Jul 1, 2025
Backside illumination type solid-state imaging device, manufacturing method for backside illumination type solid-state imaging device, imaging apparatus and electronic equipment
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations52
US12119366B2Oct 15, 2024
Solid state imaging device, solid state imaging device manufacturing method, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations52