Inventor
CHOI SI-YOUNG
KR89 patents
⚠️ This page may combine multiple inventors who share the name “CHOI SI-YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
43 patentsUS7074662B2Jul 11, 2006
Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage
SAMSUNG ELECTRONICS CO LTD176 citations99
US7323710B2Jan 29, 2008
Fin field effect transistors having multi-layer fin patterns
SAMSUNG ELECTRONICS CO LTD84 citations98
US7148541B2Dec 12, 2006
Vertical channel field effect transistors having insulating layers thereon
SAMSUNG ELECTRONICS CO LTD53 citations96
US6849520B2Feb 1, 2005
Method and device for forming an STI type isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD38 citations95
US7320908B2Jan 22, 2008
Methods of forming semiconductor devices having buried oxide patterns
SAMSUNG ELECTRONICS CO LTD34 citations93
US7176067B2Feb 13, 2007
Methods of fabricating fin field effect transistors
SAMSUNG ELECTRONICS CO LTD23 citations93
US7071048B2Jul 4, 2006
Methods of fabricating fin field effect transistors having capping insulation layers
SAMSUNG ELECTRONICS CO LTD40 citations93
US8039902B2Oct 18, 2011
Semiconductor devices having Si and SiGe epitaxial layers
SAMSUNG ELECTRONICS CO LTD39 citations92
US7842566B2Nov 30, 2010
FinFET and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US7535061B2May 19, 2009
Fin-field effect transistors (Fin-FETs) having protection layers
SAMSUNG ELECTRONICS CO LTD23 citations92
US7141456B2Nov 28, 2006
Methods of fabricating Fin-field effect transistors (Fin-FETs) having protection layers
SAMSUNG ELECTRONICS CO LTD16 citations92
US7122871B2Oct 17, 2006
Integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations
SAMSUNG ELECTRONICS CO LTD35 citations92
US6890823B2May 10, 2005
Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes wherein the source and drain are higher than the gate electrode
SAMSUNG ELECTRONICS CO LTD28 citations92
US6660613B2Dec 9, 2003
Method and device for forming an STI type isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD18 citations92
US8012828B2Sep 6, 2011
Recess gate transistor
SAMSUNG ELECTRONICS CO LTD23 citations91
US5863835AJan 26, 1999
Methods of forming electrical interconnects on semiconductor substrates
SAMSUNG ELECTRONICS CO LTD33 citations91
US6391749B1May 21, 2002
Selective epitaxial growth method in semiconductor device
SAMSUNG ELECTRONICS CO LTD22 citations89
US8039350B2Oct 18, 2011
Methods of fabricating MOS transistors having recesses with elevated source/drain regions
SAMSUNG ELECTRONICS CO LTD9 citations84
US8008698B2Aug 30, 2011
Semiconductor memory devices having vertical channel transistors and related methods
SAMSUNG ELECTRONICS CO LTD11 citations84
US7683405B2Mar 23, 2010
MOS transistors having recesses with elevated source/drain regions
SAMSUNG ELECTRONICS CO LTD12 citations84
US7642589B2Jan 5, 2010
Fin field effect transistors having capping insulation layers
SAMSUNG ELECTRONICS CO LTD9 citations84
US7521301B2Apr 21, 2009
Methods for fabricating integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations
SAMSUNG ELECTRONICS CO LTD10 citations84
US7394117B2Jul 1, 2008
Fin field effect transistors including epitaxial fins
SAMSUNG ELECTRONICS CO LTD9 citations84
US7268396B2Sep 11, 2007
Finfets having first and second gates of different resistivities
SAMSUNG ELECTRONICS CO LTD15 citations84
US7205609B2Apr 17, 2007
Methods of forming semiconductor devices including fin structures and related devices
SAMSUNG ELECTRONICS CO LTD10 citations84
US7202688B2Apr 10, 2007
Output buffer circuit having signal path used for testing and integrated circuit and test method including the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US6900102B2May 31, 2005
Methods of forming double gate electrodes using tunnel and trench
SAMSUNG ELECTRONICS CO LTD13 citations84
US9627542B2Apr 18, 2017
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations83
US8906757B2Dec 9, 2014
Methods of forming patterns of a semiconductor device
SAMSUNG ELECTRONICS CO LTD13 citations83
US7807543B2Oct 5, 2010
Methods of manufacturing trench isolation structures using selective plasma ion immersion implantation and deposition (PIIID)
SAMSUNG ELECTRONICS CO LTD8 citations83
US7338867B2Mar 4, 2008
Semiconductor device having contact pads and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations74
US6797559B2Sep 28, 2004
Method of fabricating semiconductor device having metal conducting layer
SAMSUNG ELECTRONICS CO LTD10 citations74
US6835996B2Dec 28, 2004
Method and device for forming an STI type isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations73
US6562707B2May 13, 2003
Method of forming a semiconductor device using selective epitaxial growth
SAMSUNG ELECTRONICS CO LTD8 citations72
US10904790B2Jan 26, 2021
Method and apparatus for processing traffic in radio network system
SAMSUNG ELECTRONICS CO LTD4 citations66
US8373165B2Feb 12, 2013
Semiconductor integrated circuit device and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7973355B2Jul 5, 2011
Nonvolatile memory devices with multiple layers having band gap relationships among the layers
SAMSUNG ELECTRONICS CO LTD2 citations63
US7888246B2Feb 15, 2011
Semiconductor integrated circuit device and a method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7579249B2Aug 25, 2009
Methods for fabricating DRAM semiconductor devices including silicon epitaxial and metal silicide layers
SAMSUNG ELECTRONICS CO LTD3 citations63
US7511340B2Mar 31, 2009
Semiconductor devices having gate structures and contact pads that are lower than the gate structures
SAMSUNG ELECTRONICS CO LTD2 citations63
US7429504B2Sep 30, 2008
Heterogeneous group IV semiconductor substrates, integrated circuits formed on such substrates, and related methods
SAMSUNG ELECTRONICS CO LTD6 citations63
US7185252B2Feb 27, 2007
Measurement circuit and method for serially merging single-ended signals to analyze them
SAMSUNG ELECTRONICS CO LTD3 citations63
US7081391B2Jul 25, 2006
Integrated circuit devices having buried insulation layers and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations63
KWON BYOUNG-HO
2 patentsPARK DONG-WOON
1 patentLEE SANG-RYUL
1 patentSON YONG-HOON
1 patentKIM JIN-BUM
1 patentPARK TAI-SU
1 patentShowing the top 50 of 89 patents by PatentIndex Score.