P

Inventor

CHOI SI-YOUNG

KR89 patents
⚠️ This page may combine multiple inventors who share the name “CHOI SI-YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

43 patents
US7074662B2Jul 11, 2006

Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage

SAMSUNG ELECTRONICS CO LTD176 citations99
US7323710B2Jan 29, 2008

Fin field effect transistors having multi-layer fin patterns

SAMSUNG ELECTRONICS CO LTD84 citations98
US7148541B2Dec 12, 2006

Vertical channel field effect transistors having insulating layers thereon

SAMSUNG ELECTRONICS CO LTD53 citations96
US6849520B2Feb 1, 2005

Method and device for forming an STI type isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD38 citations95
US7320908B2Jan 22, 2008

Methods of forming semiconductor devices having buried oxide patterns

SAMSUNG ELECTRONICS CO LTD34 citations93
US7176067B2Feb 13, 2007

Methods of fabricating fin field effect transistors

SAMSUNG ELECTRONICS CO LTD23 citations93
US7071048B2Jul 4, 2006

Methods of fabricating fin field effect transistors having capping insulation layers

SAMSUNG ELECTRONICS CO LTD40 citations93
US8039902B2Oct 18, 2011

Semiconductor devices having Si and SiGe epitaxial layers

SAMSUNG ELECTRONICS CO LTD39 citations92
US7842566B2Nov 30, 2010

FinFET and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD20 citations92
US7535061B2May 19, 2009

Fin-field effect transistors (Fin-FETs) having protection layers

SAMSUNG ELECTRONICS CO LTD23 citations92
US7141456B2Nov 28, 2006

Methods of fabricating Fin-field effect transistors (Fin-FETs) having protection layers

SAMSUNG ELECTRONICS CO LTD16 citations92
US7122871B2Oct 17, 2006

Integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations

SAMSUNG ELECTRONICS CO LTD35 citations92
US6890823B2May 10, 2005

Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes wherein the source and drain are higher than the gate electrode

SAMSUNG ELECTRONICS CO LTD28 citations92
US6660613B2Dec 9, 2003

Method and device for forming an STI type isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD18 citations92
US8012828B2Sep 6, 2011

Recess gate transistor

SAMSUNG ELECTRONICS CO LTD23 citations91
US5863835AJan 26, 1999

Methods of forming electrical interconnects on semiconductor substrates

SAMSUNG ELECTRONICS CO LTD33 citations91
US6391749B1May 21, 2002

Selective epitaxial growth method in semiconductor device

SAMSUNG ELECTRONICS CO LTD22 citations89
US8039350B2Oct 18, 2011

Methods of fabricating MOS transistors having recesses with elevated source/drain regions

SAMSUNG ELECTRONICS CO LTD9 citations84
US8008698B2Aug 30, 2011

Semiconductor memory devices having vertical channel transistors and related methods

SAMSUNG ELECTRONICS CO LTD11 citations84
US7683405B2Mar 23, 2010

MOS transistors having recesses with elevated source/drain regions

SAMSUNG ELECTRONICS CO LTD12 citations84
US7642589B2Jan 5, 2010

Fin field effect transistors having capping insulation layers

SAMSUNG ELECTRONICS CO LTD9 citations84
US7521301B2Apr 21, 2009

Methods for fabricating integrated circuit field effect transistors including channel-containing fin having regions of high and low doping concentrations

SAMSUNG ELECTRONICS CO LTD10 citations84
US7394117B2Jul 1, 2008

Fin field effect transistors including epitaxial fins

SAMSUNG ELECTRONICS CO LTD9 citations84
US7268396B2Sep 11, 2007

Finfets having first and second gates of different resistivities

SAMSUNG ELECTRONICS CO LTD15 citations84
US7205609B2Apr 17, 2007

Methods of forming semiconductor devices including fin structures and related devices

SAMSUNG ELECTRONICS CO LTD10 citations84
US7202688B2Apr 10, 2007

Output buffer circuit having signal path used for testing and integrated circuit and test method including the same

SAMSUNG ELECTRONICS CO LTD11 citations84
US6900102B2May 31, 2005

Methods of forming double gate electrodes using tunnel and trench

SAMSUNG ELECTRONICS CO LTD13 citations84
US9627542B2Apr 18, 2017

Semiconductor device and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD6 citations83
US8906757B2Dec 9, 2014

Methods of forming patterns of a semiconductor device

SAMSUNG ELECTRONICS CO LTD13 citations83
US7807543B2Oct 5, 2010

Methods of manufacturing trench isolation structures using selective plasma ion immersion implantation and deposition (PIIID)

SAMSUNG ELECTRONICS CO LTD8 citations83
US7338867B2Mar 4, 2008

Semiconductor device having contact pads and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD5 citations74
US6797559B2Sep 28, 2004

Method of fabricating semiconductor device having metal conducting layer

SAMSUNG ELECTRONICS CO LTD10 citations74
US6835996B2Dec 28, 2004

Method and device for forming an STI type isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations73
US6562707B2May 13, 2003

Method of forming a semiconductor device using selective epitaxial growth

SAMSUNG ELECTRONICS CO LTD8 citations72
US10904790B2Jan 26, 2021

Method and apparatus for processing traffic in radio network system

SAMSUNG ELECTRONICS CO LTD4 citations66
US8373165B2Feb 12, 2013

Semiconductor integrated circuit device and a method of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US7973355B2Jul 5, 2011

Nonvolatile memory devices with multiple layers having band gap relationships among the layers

SAMSUNG ELECTRONICS CO LTD2 citations63
US7888246B2Feb 15, 2011

Semiconductor integrated circuit device and a method of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US7579249B2Aug 25, 2009

Methods for fabricating DRAM semiconductor devices including silicon epitaxial and metal silicide layers

SAMSUNG ELECTRONICS CO LTD3 citations63
US7511340B2Mar 31, 2009

Semiconductor devices having gate structures and contact pads that are lower than the gate structures

SAMSUNG ELECTRONICS CO LTD2 citations63
US7429504B2Sep 30, 2008

Heterogeneous group IV semiconductor substrates, integrated circuits formed on such substrates, and related methods

SAMSUNG ELECTRONICS CO LTD6 citations63
US7185252B2Feb 27, 2007

Measurement circuit and method for serially merging single-ended signals to analyze them

SAMSUNG ELECTRONICS CO LTD3 citations63
US7081391B2Jul 25, 2006

Integrated circuit devices having buried insulation layers and methods of forming the same

SAMSUNG ELECTRONICS CO LTD3 citations63

KWON BYOUNG-HO

2 patents

PARK DONG-WOON

1 patent

LEE SANG-RYUL

1 patent

SON YONG-HOON

1 patent

KIM JIN-BUM

1 patent

PARK TAI-SU

1 patent

Showing the top 50 of 89 patents by PatentIndex Score.