Inventor
YOO JONG-RYEOL
KR27 patents
⚠️ This page may combine multiple inventors who share the name “YOO JONG-RYEOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
21 patentsUS7842566B2Nov 30, 2010
FinFET and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US7595213B2Sep 29, 2009
Semiconductor devices, CMOS image sensors, and methods of manufacturing same
SAMSUNG ELECTRONICS CO LTD36 citations92
US6890823B2May 10, 2005
Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes wherein the source and drain are higher than the gate electrode
SAMSUNG ELECTRONICS CO LTD28 citations92
US7696552B2Apr 13, 2010
Semiconductor devices including high-k dielectric materials
SAMSUNG ELECTRONICS CO LTD12 citations84
US7521316B2Apr 21, 2009
Methods of forming gate structures for semiconductor devices
SAMSUNG ELECTRONICS CO LTD8 citations84
US6900102B2May 31, 2005
Methods of forming double gate electrodes using tunnel and trench
SAMSUNG ELECTRONICS CO LTD13 citations84
US10164057B1Dec 25, 2018
Vertical tunneling field effect transistor and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD7 citations83
US7683421B2Mar 23, 2010
NAND-type flash memory devices including selection transistors with an anti-punchthrough impurity region and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD9 citations83
US7534709B2May 19, 2009
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD12 citations82
US7371669B2May 13, 2008
Method of forming a gate of a semiconductor device
SAMSUNG ELECTRONICS CO LTD7 citations74
US7338867B2Mar 4, 2008
Semiconductor device having contact pads and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations74
US10644158B2May 5, 2020
Semiconductor device including fin field effect transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations72
US8034701B2Oct 11, 2011
Methods of forming recessed gate electrodes having covered layer interfaces
SAMSUNG ELECTRONICS CO LTD3 citations63
US7772637B2Aug 10, 2010
Semiconductor devices including gate structures and leakage barrier oxides
SAMSUNG ELECTRONICS CO LTD3 citations63
US7582931B2Sep 1, 2009
Recessed gate electrodes having covered layer interfaces and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US7579249B2Aug 25, 2009
Methods for fabricating DRAM semiconductor devices including silicon epitaxial and metal silicide layers
SAMSUNG ELECTRONICS CO LTD3 citations63
US7511340B2Mar 31, 2009
Semiconductor devices having gate structures and contact pads that are lower than the gate structures
SAMSUNG ELECTRONICS CO LTD2 citations63
US7081391B2Jul 25, 2006
Integrated circuit devices having buried insulation layers and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US6963094B2Nov 8, 2005
Metal oxide semiconductor transistors having a drain punch through blocking region and methods for fabricating metal oxide semiconductor transistors having a drain punch through blocking region
SAMSUNG ELECTRONICS CO LTD4 citations63
US10892347B2Jan 12, 2021
Vertical tunneling field effect transistor and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10319858B2Jun 11, 2019
Semiconductor devices having lower and upper fins and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
RYU JEONG-DO
3 patentsUS9190495B2Nov 17, 2015
Recessed channel array transistors, and semiconductor devices including a recessed channel array transistor
RYU JEONG-DO1 citations49
US8501611B2Aug 6, 2013
Methods of forming integrated circuit devices having electrically conductive layers therein with partially nitridated sidewalls
RYU JEONG-DO0 citations49
US8252681B2Aug 28, 2012
Methods of forming integrated circuit devices having electrically conductive layers therein with partially nitridated sidewalls
RYU JEONG-DO0 citations49