P

Inventor

YOO JONG-RYEOL

KR27 patents
⚠️ This page may combine multiple inventors who share the name “YOO JONG-RYEOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

21 patents
US7842566B2Nov 30, 2010

FinFET and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD20 citations92
US7595213B2Sep 29, 2009

Semiconductor devices, CMOS image sensors, and methods of manufacturing same

SAMSUNG ELECTRONICS CO LTD36 citations92
US6890823B2May 10, 2005

Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes wherein the source and drain are higher than the gate electrode

SAMSUNG ELECTRONICS CO LTD28 citations92
US7696552B2Apr 13, 2010

Semiconductor devices including high-k dielectric materials

SAMSUNG ELECTRONICS CO LTD12 citations84
US7521316B2Apr 21, 2009

Methods of forming gate structures for semiconductor devices

SAMSUNG ELECTRONICS CO LTD8 citations84
US6900102B2May 31, 2005

Methods of forming double gate electrodes using tunnel and trench

SAMSUNG ELECTRONICS CO LTD13 citations84
US10164057B1Dec 25, 2018

Vertical tunneling field effect transistor and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD7 citations83
US7683421B2Mar 23, 2010

NAND-type flash memory devices including selection transistors with an anti-punchthrough impurity region and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD9 citations83
US7534709B2May 19, 2009

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD12 citations82
US7371669B2May 13, 2008

Method of forming a gate of a semiconductor device

SAMSUNG ELECTRONICS CO LTD7 citations74
US7338867B2Mar 4, 2008

Semiconductor device having contact pads and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD5 citations74
US10644158B2May 5, 2020

Semiconductor device including fin field effect transistor and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD5 citations72
US8034701B2Oct 11, 2011

Methods of forming recessed gate electrodes having covered layer interfaces

SAMSUNG ELECTRONICS CO LTD3 citations63
US7772637B2Aug 10, 2010

Semiconductor devices including gate structures and leakage barrier oxides

SAMSUNG ELECTRONICS CO LTD3 citations63
US7582931B2Sep 1, 2009

Recessed gate electrodes having covered layer interfaces and methods of forming the same

SAMSUNG ELECTRONICS CO LTD3 citations63
US7579249B2Aug 25, 2009

Methods for fabricating DRAM semiconductor devices including silicon epitaxial and metal silicide layers

SAMSUNG ELECTRONICS CO LTD3 citations63
US7511340B2Mar 31, 2009

Semiconductor devices having gate structures and contact pads that are lower than the gate structures

SAMSUNG ELECTRONICS CO LTD2 citations63
US7081391B2Jul 25, 2006

Integrated circuit devices having buried insulation layers and methods of forming the same

SAMSUNG ELECTRONICS CO LTD3 citations63
US6963094B2Nov 8, 2005

Metal oxide semiconductor transistors having a drain punch through blocking region and methods for fabricating metal oxide semiconductor transistors having a drain punch through blocking region

SAMSUNG ELECTRONICS CO LTD4 citations63
US10892347B2Jan 12, 2021

Vertical tunneling field effect transistor and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US10319858B2Jun 11, 2019

Semiconductor devices having lower and upper fins and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations52

RYU JEONG-DO

3 patents

JEON IN-SANG

1 patent

KIM SUNG MIN

1 patent

PARK TAI-SU

1 patent