Inventor
SATO AKINORI
JP49 patents
⚠️ This page may combine multiple inventors who share the name “SATO AKINORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KYOCERA CORP
14 patentsUS6556169B1Apr 29, 2003
High frequency circuit integrated-type antenna component
KYOCERA CORP96 citations96
US6832081B1Dec 14, 2004
Nonradiative dielectric waveguide and a millimeter-wave transmitting/receiving apparatus
KYOCERA CORP27 citations92
US7196667B2Mar 27, 2007
Surface-mount type antenna and antenna apparatus employing the same, and wireless communication apparatus
KYOCERA CORP18 citations84
US7109944B2Sep 19, 2006
Antenna using variable capacitance element and wireless communication apparatus using the same
KYOCERA CORP14 citations84
US7098852B2Aug 29, 2006
Antenna, antenna module and radio communication apparatus provided with the same
KYOCERA CORP13 citations84
US7038627B2May 2, 2006
Surface mounting type antenna, antenna apparatus and radio communication apparatus
KYOCERA CORP14 citations84
US7026994B2Apr 11, 2006
Surface-mount type antenna and antenna apparatus
KYOCERA CORP20 citations83
US6806832B2Oct 19, 2004
Surface-mount type antenna and antenna apparatus
KYOCERA CORP17 citations83
US6970135B2Nov 29, 2005
Antenna apparatus
KYOCERA CORP12 citations82
US7145509B2Dec 5, 2006
Array antenna and radio communication apparatus using the same
KYOCERA CORP10 citations74
US6903691B2Jun 7, 2005
Surface-mount type antenna and antenna apparatus
KYOCERA CORP9 citations73
US6822620B2Nov 23, 2004
Helical antenna and communication apparatus
KYOCERA CORP8 citations72
US6653986B2Nov 25, 2003
Meander antenna and method for tuning resonance frequency of the same
KYOCERA CORP10 citations72
US7352277B2Apr 1, 2008
Antenna for tire pressure information sending apparatus and tire pressure information sending apparatus using the same
KYOCERA CORP3 citations63
LINTEC CORP
8 patentsUS7169648B2Jan 30, 2007
Process for producing a semiconductor device
LINTEC CORP8 citations74
US10192768B2Jan 29, 2019
Sheet for semiconductor processing
LINTEC CORP2 citations73
US11267992B2Mar 8, 2022
Film-shaped firing material and film-shaped firing material with support sheet
LINTEC CORP0 citations61
US11781033B2Oct 10, 2023
Method of forming first protective film
LINTEC CORP0 citations49
US11594458B2Feb 28, 2023
Curable resin film and first protective film forming sheet
LINTEC CORP0 citations49
US10717901B2Jul 21, 2020
Curable resin film and first protective film forming sheet
LINTEC CORP0 citations49
US10515830B2Dec 24, 2019
First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip
LINTEC CORP0 citations49
US10086594B2Oct 2, 2018
Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device
LINTEC CORP0 citations44
SATO AKINORI
4 patentsUS8409308B2Apr 2, 2013
Process for manufacturing polishing pad
SATO AKINORI6 citations71
US9546801B2Jan 17, 2017
Solar-thermal conversion member, solar-thermal conversion device, and solar thermal power generation device comprising a β-FeSi2 phase material
SATO AKINORI2 citations67
US9079289B2Jul 14, 2015
Polishing pad
SATO AKINORI2 citations61
US8979611B2Mar 17, 2015
Polishing pad, production method for same, and production method for glass substrate
SATO AKINORI0 citations47
KANEKA CORP
4 patentsUS12378406B2Aug 5, 2025
Mixture of polyoxyalkylene polymers and curable composition
KANEKA CORP0 citations52
US12234322B2Feb 25, 2025
Polyoxyalkylene polymer and curable composition
KANEKA CORP0 citations52
US12152143B2Nov 26, 2024
Curable composition and cured product
KANEKA CORP0 citations52
US10287399B2May 14, 2019
Curable composition and cured article obtained therefrom
KANEKA CORP0 citations39