P

Inventor

LIU CHIH-CHIEN

TW115 patents
⚠️ This page may combine multiple inventors who share the name “LIU CHIH-CHIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

36 patents
US6203863B1Mar 20, 2001

Method of gap filling

UNITED MICROELECTRONICS CORP318 citations99
US5968610AOct 19, 1999

Multi-step high density plasma chemical vapor deposition process

UNITED MICROELECTRONICS CORP371 citations98
US6323123B1Nov 27, 2001

Low-K dual damascene integration process

UNITED MICROELECTRONICS CORP71 citations96
US6117345ASep 12, 2000

High density plasma chemical vapor deposition process

UNITED MICROELECTRONICS CORP44 citations95
US6410446B1Jun 25, 2002

Method for gap filling

UNITED MICROELECTRONICS CORP29 citations93
US6339025B1Jan 15, 2002

Method of fabricating a copper capping layer

UNITED MICROELECTRONICS CORP33 citations93
US6319814B1Nov 20, 2001

Method of fabricating dual damascene

UNITED MICROELECTRONICS CORP38 citations93
US6239018B1May 29, 2001

Method for forming dielectric layers

UNITED MICROELECTRONICS CORP29 citations93
US6218284B1Apr 17, 2001

Method for forming an inter-metal dielectric layer

UNITED MICROELECTRONICS CORP24 citations93
US6197681B1Mar 6, 2001

Forming copper interconnects in dielectric materials with low constant dielectrics

UNITED MICROELECTRONICS CORP38 citations93
US8709901B1Apr 29, 2014

Method of forming an isolation structure

UNITED MICROELECTRONICS CORP26 citations92
US6440861B1Aug 27, 2002

Method of forming dual damascene structure

UNITED MICROELECTRONICS CORP21 citations92
US6146974ANov 14, 2000

Method of fabricating shallow trench isolation (STI)

UNITED MICROELECTRONICS CORP32 citations92
US6100205AAug 8, 2000

Intermetal dielectric layer formation with low dielectric constant using high density plasma chemical vapor deposition process

UNITED MICROELECTRONICS CORP27 citations92
US6174793B1Jan 16, 2001

Method for enhancing adhesion between copper and silicon nitride

UNITED MICROELECTRONICS CORP28 citations89
US10283564B1May 7, 2019

Semiconductor structure and the method of making the same

UNITED MICROELECTRONICS CORP8 citations84
US10269868B1Apr 23, 2019

Semiconductor structure and the method of making the same

UNITED MICROELECTRONICS CORP12 citations84
US10177311B1Jan 8, 2019

Resistive random access memory (RRAM) and fabrication method thereof

UNITED MICROELECTRONICS CORP11 citations84
US9263257B2Feb 16, 2016

Semiconductor device having fin-shaped structure and method for fabricating the same

UNITED MICROELECTRONICS CORP8 citations84
US6905938B2Jun 14, 2005

Method of forming interconnect structure with low dielectric constant

UNITED MICROELECTRONICS CORP17 citations84
US8951884B1Feb 10, 2015

Method for forming a FinFET structure

UNITED MICROELECTRONICS CORP7 citations83
US8937369B2Jan 20, 2015

Transistor with non-uniform stress layer with stress concentrated regions

UNITED MICROELECTRONICS CORP7 citations83
US9362358B2Jun 7, 2016

Spatial semiconductor structure

UNITED MICROELECTRONICS CORP6 citations81
US7557043B2Jul 7, 2009

Method of fabricating the stacked structure and damascene process

UNITED MICROELECTRONICS CORP6 citations74
US6562731B2May 13, 2003

Method for forming dielectric layers

UNITED MICROELECTRONICS CORP7 citations74
US6387813B1May 14, 2002

Method for stripping a low dielectric film with high carbon content

UNITED MICROELECTRONICS CORP7 citations74
US6376394B1Apr 23, 2002

Method of forming inter-metal dielectric layer

UNITED MICROELECTRONICS CORP9 citations74
US6261977B1Jul 17, 2001

Method for preventing an electrostatic chuck from being corroded during a cleaning process

UNITED MICROELECTRONICS CORP11 citations74
US6248644B1Jun 19, 2001

Method of fabricating shallow trench isolation structure

UNITED MICROELECTRONICS CORP10 citations74
US6200653B1Mar 13, 2001

Method of forming an intermetal dielectric layer

UNITED MICROELECTRONICS CORP9 citations74
US6048796AApr 11, 2000

Method of manufacturing multilevel metal interconnect

UNITED MICROELECTRONICS CORP12 citations74
US5976984ANov 2, 1999

Process of making unlanded vias

UNITED MICROELECTRONICS CORP10 citations74
US9263282B2Feb 16, 2016

Method of fabricating semiconductor patterns

UNITED MICROELECTRONICS CORP5 citations73
US9159831B2Oct 13, 2015

Multigate field effect transistor and process thereof

UNITED MICROELECTRONICS CORP4 citations73
US7271101B2Sep 18, 2007

High density plasma chemical vapor deposition process

UNITED MICROELECTRONICS CORP6 citations73
US7078346B2Jul 18, 2006

High density plasma chemical vapor deposition process

UNITED MICROELECTRONICS CORP5 citations73

LIU CHIH-CHIEN

4 patents

CHIEN CHIN-CHENG

3 patents

TSAI SHIH-HUNG

1 patent

INFINEON TECHNOLOGIES AG

1 patent

UNITED MICROELECTRTONICS CORP

1 patent

LIN CHIN-FU

1 patent

TSAI TENG-CHUN

1 patent

TRICORE CORP

1 patent

IBM

1 patent

Showing the top 50 of 115 patents by PatentIndex Score.