Inventor
LIU CHIH-CHIEN
TW115 patents
⚠️ This page may combine multiple inventors who share the name “LIU CHIH-CHIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
36 patentsUS6203863B1Mar 20, 2001
Method of gap filling
UNITED MICROELECTRONICS CORP318 citations99
US5968610AOct 19, 1999
Multi-step high density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP371 citations98
US6323123B1Nov 27, 2001
Low-K dual damascene integration process
UNITED MICROELECTRONICS CORP71 citations96
US6117345ASep 12, 2000
High density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP44 citations95
US6410446B1Jun 25, 2002
Method for gap filling
UNITED MICROELECTRONICS CORP29 citations93
US6339025B1Jan 15, 2002
Method of fabricating a copper capping layer
UNITED MICROELECTRONICS CORP33 citations93
US6319814B1Nov 20, 2001
Method of fabricating dual damascene
UNITED MICROELECTRONICS CORP38 citations93
US6239018B1May 29, 2001
Method for forming dielectric layers
UNITED MICROELECTRONICS CORP29 citations93
US6218284B1Apr 17, 2001
Method for forming an inter-metal dielectric layer
UNITED MICROELECTRONICS CORP24 citations93
US6197681B1Mar 6, 2001
Forming copper interconnects in dielectric materials with low constant dielectrics
UNITED MICROELECTRONICS CORP38 citations93
US8709901B1Apr 29, 2014
Method of forming an isolation structure
UNITED MICROELECTRONICS CORP26 citations92
US6440861B1Aug 27, 2002
Method of forming dual damascene structure
UNITED MICROELECTRONICS CORP21 citations92
US6146974ANov 14, 2000
Method of fabricating shallow trench isolation (STI)
UNITED MICROELECTRONICS CORP32 citations92
US6100205AAug 8, 2000
Intermetal dielectric layer formation with low dielectric constant using high density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP27 citations92
US6174793B1Jan 16, 2001
Method for enhancing adhesion between copper and silicon nitride
UNITED MICROELECTRONICS CORP28 citations89
US10283564B1May 7, 2019
Semiconductor structure and the method of making the same
UNITED MICROELECTRONICS CORP8 citations84
US10269868B1Apr 23, 2019
Semiconductor structure and the method of making the same
UNITED MICROELECTRONICS CORP12 citations84
US10177311B1Jan 8, 2019
Resistive random access memory (RRAM) and fabrication method thereof
UNITED MICROELECTRONICS CORP11 citations84
US9263257B2Feb 16, 2016
Semiconductor device having fin-shaped structure and method for fabricating the same
UNITED MICROELECTRONICS CORP8 citations84
US6905938B2Jun 14, 2005
Method of forming interconnect structure with low dielectric constant
UNITED MICROELECTRONICS CORP17 citations84
US8951884B1Feb 10, 2015
Method for forming a FinFET structure
UNITED MICROELECTRONICS CORP7 citations83
US8937369B2Jan 20, 2015
Transistor with non-uniform stress layer with stress concentrated regions
UNITED MICROELECTRONICS CORP7 citations83
US9362358B2Jun 7, 2016
Spatial semiconductor structure
UNITED MICROELECTRONICS CORP6 citations81
US7557043B2Jul 7, 2009
Method of fabricating the stacked structure and damascene process
UNITED MICROELECTRONICS CORP6 citations74
US6562731B2May 13, 2003
Method for forming dielectric layers
UNITED MICROELECTRONICS CORP7 citations74
US6387813B1May 14, 2002
Method for stripping a low dielectric film with high carbon content
UNITED MICROELECTRONICS CORP7 citations74
US6376394B1Apr 23, 2002
Method of forming inter-metal dielectric layer
UNITED MICROELECTRONICS CORP9 citations74
US6261977B1Jul 17, 2001
Method for preventing an electrostatic chuck from being corroded during a cleaning process
UNITED MICROELECTRONICS CORP11 citations74
US6248644B1Jun 19, 2001
Method of fabricating shallow trench isolation structure
UNITED MICROELECTRONICS CORP10 citations74
US6200653B1Mar 13, 2001
Method of forming an intermetal dielectric layer
UNITED MICROELECTRONICS CORP9 citations74
US6048796AApr 11, 2000
Method of manufacturing multilevel metal interconnect
UNITED MICROELECTRONICS CORP12 citations74
US5976984ANov 2, 1999
Process of making unlanded vias
UNITED MICROELECTRONICS CORP10 citations74
US9263282B2Feb 16, 2016
Method of fabricating semiconductor patterns
UNITED MICROELECTRONICS CORP5 citations73
US9159831B2Oct 13, 2015
Multigate field effect transistor and process thereof
UNITED MICROELECTRONICS CORP4 citations73
US7271101B2Sep 18, 2007
High density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP6 citations73
US7078346B2Jul 18, 2006
High density plasma chemical vapor deposition process
UNITED MICROELECTRONICS CORP5 citations73
LIU CHIH-CHIEN
4 patentsUS8062536B2Nov 22, 2011
High density plasma chemical vapor deposition process
LIU CHIH-CHIEN20 citations91
US8324118B2Dec 4, 2012
Manufacturing method of metal gate structure
LIU CHIH-CHIEN11 citations84
US8772904B2Jul 8, 2014
Semiconductor structure and process thereof
LIU CHIH-CHIEN12 citations83
US8954805B2Feb 10, 2015
Computer booting method and computer system
LIU CHIH-CHIEN9 citations75
CHIEN CHIN-CHENG
3 patentsTSAI SHIH-HUNG
1 patentINFINEON TECHNOLOGIES AG
1 patentUNITED MICROELECTRTONICS CORP
1 patentLIN CHIN-FU
1 patentTSAI TENG-CHUN
1 patentTRICORE CORP
1 patentIBM
1 patentShowing the top 50 of 115 patents by PatentIndex Score.