Inventor
HSIEH JERWEI
TW8 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH JERWEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WALSIN LIHWA CORP
4 patentsUS7247247B2Jul 24, 2007
Selective etching method
WALSIN LIHWA CORP10 citations81
US7088030B2Aug 8, 2006
High-aspect-ratio-microstructure (HARM)
WALSIN LIHWA CORP7 citations70
US6949396B2Sep 27, 2005
Corner compensation method for fabricating MEMS and structure thereof
WALSIN LIHWA CORP2 citations60
US7180144B2Feb 20, 2007
Corner compensation method for fabricating MEMS and structure thereof
WALSIN LIHWA CORP1 citations50
ASIA PACIFIC MICROSYSTEMS INC
3 patentsUS8916449B2Dec 23, 2014
Package structure and substrate bonding method
ASIA PACIFIC MICROSYSTEMS INC2 citations55
US9676609B2Jun 13, 2017
Integrated MEMS device
ASIA PACIFIC MICROSYSTEMS INC0 citations49
US9359193B2Jun 7, 2016
Method for manufacturing an integrated MEMS device
ASIA PACIFIC MICROSYSTEMS INC1 citations49