Inventor
TSAI JEN-YI
TW2 patents
Patents
2 patentsUS6772512B2Aug 10, 2004
Method of fabricating a flip-chip ball-grid-array package without causing mold flash
SILICONWARE PRECISION INDUSTRIES CO LTD33 citations89
US6359342B1Mar 19, 2002
Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD37 citations86