P

Inventor

GOH SEOK

KR7 patents
⚠️ This page may combine multiple inventors who share the name “GOH SEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

4 patents
US7485955B2Feb 3, 2009

Semiconductor package having step type die and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD30 citations92
US6408507B1Jun 25, 2002

Heat sink to semiconductor module assembly equipment and method

SAMSUNG ELECTRONICS CO LTD19 citations81
US6698486B2Mar 2, 2004

Apparatus for removing wafer ring tape

SAMSUNG ELECTRONICS CO LTD8 citations71
US6343503B1Feb 5, 2002

Module appearance inspection apparatus

SAMSUNG ELECTRONICS CO LTD10 citations71

KIM SANG-GEUN

1 patent
US8546938B2Oct 1, 2013

Stacked package including spacers and method of manufacturing the same

KIM SANG-GEUN11 citations80

HAN JONG-WON

1 patent
US8564317B2Oct 22, 2013

Test socket, and test apparatus with test socket to control a temperature of an object to be tested

HAN JONG-WON6 citations66

KIM TAEHYUN

1 patent
US9130011B2Sep 8, 2015

Apparatus for mounting semiconductor device

KIM TAEHYUN0 citations35