Inventor
KUROSAWA TETSUYA
JP39 patents
⚠️ This page may combine multiple inventors who share the name “KUROSAWA TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
29 patentsUS6555418B2Apr 29, 2003
Method for separating a semiconductor element in a semiconductor element pushing-up device
TOSHIBA KK108 citations98
US7060593B2Jun 13, 2006
Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer
TOSHIBA KK57 citations96
US6709543B2Mar 23, 2004
Semiconductor chip pickup device and pickup method
TOSHIBA KK55 citations96
US6352073B1Mar 5, 2002
Semiconductor manufacturing equipment
TOSHIBA KK68 citations96
US6201306B1Mar 13, 2001
Push-up pin of a semiconductor element pushing-up device, and a method for separating
TOSHIBA KK67 citations96
US6337258B1Jan 8, 2002
Method of dividing a wafer
TOSHIBA KK59 citations95
US7140951B2Nov 28, 2006
Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafer
TOSHIBA KK21 citations92
US6774011B2Aug 10, 2004
Chip pickup device and method of manufacturing semiconductor device
TOSHIBA KK21 citations92
US6756562B1Jun 29, 2004
Semiconductor wafer dividing apparatus and semiconductor device manufacturing method
TOSHIBA KK39 citations92
US6699774B2Mar 2, 2004
Wafer splitting method using cleavage
TOSHIBA KK24 citations92
US7675153B2Mar 9, 2010
Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof
TOSHIBA KK30 citations91
US7642113B2Jan 5, 2010
Semiconductor wafer dividing method
TOSHIBA KK15 citations84
US7932162B2Apr 26, 2011
Method for manufacturing a stacked semiconductor package, and stacked semiconductor package
TOSHIBA KK7 citations83
US7638858B2Dec 29, 2009
Semiconductor device and manufacturing method thereof
TOSHIBA KK8 citations83
US7217640B2May 15, 2007
Semiconductor device and manufacturing method thereof
TOSHIBA KK10 citations83
US6777313B2Aug 17, 2004
Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time
TOSHIBA KK17 citations82
US7300818B2Nov 27, 2007
Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer
TOSHIBA KK7 citations74
US7202563B2Apr 10, 2007
Semiconductor device package having a semiconductor element with resin
TOSHIBA KK7 citations73
US9887311B2Feb 6, 2018
Semiconductor module having a light-transmissive insulating body
TOSHIBA KK2 citations72
US7892890B2Feb 22, 2011
Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof
TOSHIBA KK6 citations72
US7631680B2Dec 15, 2009
Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer
TOSHIBA KK1 citations63
US6933606B2Aug 23, 2005
Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same
TOSHIBA KK2 citations63
US6933211B2Aug 23, 2005
Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same
TOSHIBA KK3 citations63
US7405159B2Jul 29, 2008
Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface
TOSHIBA KK3 citations62
US6739326B2May 25, 2004
Semiconductor manufacturing equipment
TOSHIBA KK1 citations52
US7608911B2Oct 27, 2009
Semiconductor device package having a semiconductor element with a roughened surface
TOSHIBA KK0 citations51
US7294558B2Nov 13, 2007
Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid
TOSHIBA KK1 citations51
US10490485B2Nov 26, 2019
Semiconductor device
TOSHIBA KK0 citations49
US10026677B2Jul 17, 2018
Semiconductor device
TOSHIBA KK0 citations49
LINTEC CORP
3 patentsUS7223319B2May 29, 2007
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
LINTEC CORP19 citations82
US7060532B2Jun 13, 2006
Manufacturing method of semiconductor device
LINTEC CORP17 citations82
US7172673B2Feb 6, 2007
Peeling device and peeling method
LINTEC CORP11 citations77