Inventor
TAKYU SHINYA
JP26 patents
⚠️ This page may combine multiple inventors who share the name “TAKYU SHINYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
19 patentsUS5888883AMar 30, 1999
Method of dividing a wafer and method of manufacturing a semiconductor device
TOSHIBA KK221 citations97
US7060593B2Jun 13, 2006
Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer
TOSHIBA KK57 citations96
US6294439B1Sep 25, 2001
Method of dividing a wafer and method of manufacturing a semiconductor device
TOSHIBA KK139 citations96
US6337258B1Jan 8, 2002
Method of dividing a wafer
TOSHIBA KK59 citations95
US6184109B1Feb 6, 2001
Method of dividing a wafer and method of manufacturing a semiconductor device
TOSHIBA KK76 citations94
US7135384B2Nov 14, 2006
Semiconductor wafer dividing method and apparatus
TOSHIBA KK38 citations92
US6774011B2Aug 10, 2004
Chip pickup device and method of manufacturing semiconductor device
TOSHIBA KK21 citations92
US6756562B1Jun 29, 2004
Semiconductor wafer dividing apparatus and semiconductor device manufacturing method
TOSHIBA KK39 citations92
US6699774B2Mar 2, 2004
Wafer splitting method using cleavage
TOSHIBA KK24 citations92
US7285864B2Oct 23, 2007
Stack MCP
TOSHIBA KK20 citations91
US7932162B2Apr 26, 2011
Method for manufacturing a stacked semiconductor package, and stacked semiconductor package
TOSHIBA KK7 citations83
US7482695B2Jan 27, 2009
Stack MCP and manufacturing method thereof
TOSHIBA KK11 citations82
US6838316B2Jan 4, 2005
Semiconductor device manufacturing method using ultrasonic flip chip bonding technique
TOSHIBA KK15 citations82
US6777313B2Aug 17, 2004
Semiconductor device manufacturing method for reinforcing chip by use of seal member at pickup time
TOSHIBA KK17 citations82
US7300818B2Nov 27, 2007
Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer
TOSHIBA KK7 citations74
US8771456B2Jul 8, 2014
Method of manufacturing a semiconductor device and substrate separating apparatus
TOSHIBA KK5 citations72
US7631680B2Dec 15, 2009
Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer
TOSHIBA KK1 citations63
US7294558B2Nov 13, 2007
Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid
TOSHIBA KK1 citations51
US7833836B2Nov 16, 2010
Stack MCP and manufacturing method thereof
TOSHIBA KK1 citations50
LINTEC CORP
3 patentsUS6465330B1Oct 15, 2002
Method for grinding a wafer back
LINTEC CORP64 citations96
US7223319B2May 29, 2007
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
LINTEC CORP19 citations82
US7060532B2Jun 13, 2006
Manufacturing method of semiconductor device
LINTEC CORP17 citations82