Inventor

PAI VINAY

US3 patents

Patents

3 patents

US11947712B2Apr 2, 2024

Secure identification of wafer and chip

IBM0 citations58

US12550671B2Feb 10, 2026

Pixelated chuck for retaining warped semiconductor wafers

IBM0 citations57

US12254992B2Mar 18, 2025

Contact tracing utilizing device signatures captured during transactions

IBM0 citations47