Inventor
KAINUMA NORIO
JP44 patents
⚠️ This page may combine multiple inventors who share the name “KAINUMA NORIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
42 patentsUS6483190B1Nov 19, 2002
Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method
FUJITSU LTD29 citations93
US6400529B1Jun 4, 2002
Integrated circuit chip supporting and electrically connecting a head slider
FUJITSU LTD28 citations93
US7514788B2Apr 7, 2009
Structure of mounting electronic component
FUJITSU LTD13 citations92
US6943971B2Sep 13, 2005
Slider tester
FUJITSU LTD29 citations92
US6885522B1Apr 26, 2005
Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation
FUJITSU LTD17 citations92
US6437450B1Aug 20, 2002
Method of mounting semiconductor chip
FUJITSU LTD38 citations92
US6240634B1Jun 5, 2001
Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
FUJITSU LTD19 citations92
US6006426ADec 28, 1999
Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
FUJITSU LTD21 citations92
US7347347B2Mar 25, 2008
Head assembly, disk unit, and bonding method and apparatus
FUJITSU LTD15 citations84
US6716665B2Apr 6, 2004
Method of mounting chip onto printed circuit board in shortened working time
FUJITSU LTD13 citations84
US6582993B1Jun 24, 2003
Method of underfilling semiconductor device
FUJITSU LTD17 citations84
US6122823ASep 26, 2000
Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
FUJITSU LTD15 citations82
US7436062B2Oct 14, 2008
Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method
FUJITSU LTD6 citations74
US7424966B2Sep 16, 2008
Method of ultrasonic mounting and ultrasonic mounting apparatus using the same
FUJITSU LTD7 citations74
US7394163B2Jul 1, 2008
Method of mounting semiconductor chip
FUJITSU LTD6 citations74
US6770319B2Aug 3, 2004
Resin coating method
FUJITSU LTD7 citations74
US10103126B2Oct 16, 2018
Laminated semiconductor device and manufacturing method of laminated semiconductor device
FUJITSU LTD2 citations73
US9719848B2Aug 1, 2017
Optical module, method for manufacturing optical module, and optical transceiver
FUJITSU LTD2 citations73
US7566586B2Jul 28, 2009
Method of manufacturing a semiconductor device
FUJITSU LTD7 citations73
US7471081B2Dec 30, 2008
Slider tester
FUJITSU LTD8 citations73
US6369985B1Apr 9, 2002
Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspension
FUJITSU LTD10 citations73
US10103510B2Oct 16, 2018
Optical module and method of manufacturing optical module
FUJITSU LTD4 citations72
US9536857B1Jan 3, 2017
Heating header of semiconductor mounting apparatus and bonding method for semiconductor
FUJITSU LTD5 citations71
US7196512B2Mar 27, 2007
Magnetic head tester
FUJITSU LTD8 citations71
US7355285B2Apr 8, 2008
Structure of mounting electronic component
FUJITSU LTD4 citations63
US7350685B2Apr 1, 2008
Method of mounting electronic component
FUJITSU LTD2 citations63
US7208059B2Apr 24, 2007
Method of ultrasonic-mounting electronic component and ultrasonic mounting machine
FUJITSU LTD4 citations63
US10261249B2Apr 16, 2019
Optical module and method of manufacturing optical module
FUJITSU LTD1 citations62
US6458237B1Oct 1, 2002
Mounting method of semiconductor device
FUJITSU LTD4 citations62
US7833831B2Nov 16, 2010
Method of manufacturing an electronic component and an electronic device
FUJITSU LTD2 citations61
US7828193B2Nov 9, 2010
Method of mounting an electronic component and mounting apparatus
FUJITSU LTD6 citations61
US10718907B2Jul 21, 2020
Holding member and optical module
FUJITSU LTD0 citations52
US9013048B2Apr 21, 2015
Semiconductor device manufacturing method and semiconductor device
FUJITSU LTD0 citations52
US7712650B2May 11, 2010
Method of mounting a semiconductor chip
FUJITSU LTD1 citations52
US7507654B2Mar 24, 2009
Method for mounting electronic element on a circuit board
FUJITSU LTD0 citations52
US6787925B2Sep 7, 2004
Mounting method of semiconductor device
FUJITSU LTD0 citations52
US10586770B2Mar 10, 2020
Optical module
FUJITSU LTD0 citations51
US10444450B2Oct 15, 2019
Optical module
FUJITSU LTD0 citations51
US9793221B2Oct 17, 2017
Semiconductor device mounting method
FUJITSU LTD1 citations51
US9547126B2Jan 17, 2017
Optical waveguide sheet, optical unit, and method for manufacturing the same
FUJITSU LTD0 citations49
US9453973B2Sep 27, 2016
Fabrication method for optical connector and optical connector
FUJITSU LTD0 citations49
US7416921B2Aug 26, 2008
Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin
FUJITSU LTD0 citations42