Inventor
KOBAE KENJI
JP43 patents
⚠️ This page may combine multiple inventors who share the name “KOBAE KENJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
35 patentsUS7385788B2Jun 10, 2008
Carriage assembly of a hard disk drive
FUJITSU LTD38 citations93
US7514788B2Apr 7, 2009
Structure of mounting electronic component
FUJITSU LTD13 citations92
US6885522B1Apr 26, 2005
Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation
FUJITSU LTD17 citations92
US6437450B1Aug 20, 2002
Method of mounting semiconductor chip
FUJITSU LTD38 citations92
US6240634B1Jun 5, 2001
Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
FUJITSU LTD19 citations92
US6006426ADec 28, 1999
Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
FUJITSU LTD21 citations92
US7347347B2Mar 25, 2008
Head assembly, disk unit, and bonding method and apparatus
FUJITSU LTD15 citations84
US6716665B2Apr 6, 2004
Method of mounting chip onto printed circuit board in shortened working time
FUJITSU LTD13 citations84
US6582993B1Jun 24, 2003
Method of underfilling semiconductor device
FUJITSU LTD17 citations84
US6122823ASep 26, 2000
Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
FUJITSU LTD15 citations82
US7424966B2Sep 16, 2008
Method of ultrasonic mounting and ultrasonic mounting apparatus using the same
FUJITSU LTD7 citations74
US7394163B2Jul 1, 2008
Method of mounting semiconductor chip
FUJITSU LTD6 citations74
US7134588B2Nov 14, 2006
Bonding tool for ultrasonic bonding and method of ultrasonic bonding
FUJITSU LTD8 citations74
US6770319B2Aug 3, 2004
Resin coating method
FUJITSU LTD7 citations74
US7566586B2Jul 28, 2009
Method of manufacturing a semiconductor device
FUJITSU LTD7 citations73
US7471081B2Dec 30, 2008
Slider tester
FUJITSU LTD8 citations73
US7196512B2Mar 27, 2007
Magnetic head tester
FUJITSU LTD8 citations71
US7982295B2Jul 19, 2011
Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
FUJITSU LTD5 citations63
US7960215B2Jun 14, 2011
Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
FUJITSU LTD4 citations63
US7902983B2Mar 8, 2011
RFID tag
FUJITSU LTD2 citations63
US7789316B2Sep 7, 2010
Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
FUJITSU LTD2 citations63
US7687314B2Mar 30, 2010
Electronic apparatus manufacturing method
FUJITSU LTD2 citations63
US7670873B2Mar 2, 2010
Method of flip-chip mounting
FUJITSU LTD3 citations63
US7356907B2Apr 15, 2008
Method of manufacturing a carriage assembly of a hard disk drive
FUJITSU LTD3 citations63
US7355285B2Apr 8, 2008
Structure of mounting electronic component
FUJITSU LTD4 citations63
US7350685B2Apr 1, 2008
Method of mounting electronic component
FUJITSU LTD2 citations63
US7208059B2Apr 24, 2007
Method of ultrasonic-mounting electronic component and ultrasonic mounting machine
FUJITSU LTD4 citations63
US8381963B2Feb 26, 2013
Compression-bonding apparatus
FUJITSU LTD4 citations62
US6458237B1Oct 1, 2002
Mounting method of semiconductor device
FUJITSU LTD4 citations62
US7712650B2May 11, 2010
Method of mounting a semiconductor chip
FUJITSU LTD1 citations52
US7582553B2Sep 1, 2009
Method of bonding flying leads
FUJITSU LTD0 citations52
US7507654B2Mar 24, 2009
Method for mounting electronic element on a circuit board
FUJITSU LTD0 citations52
US7367108B2May 6, 2008
Method of bonding flying leads
FUJITSU LTD0 citations52
US6787925B2Sep 7, 2004
Mounting method of semiconductor device
FUJITSU LTD0 citations52
US7416921B2Aug 26, 2008
Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin
FUJITSU LTD0 citations42