Inventor
NAKAMURA KIMIO
JP30 patents
⚠️ This page may combine multiple inventors who share the name “NAKAMURA KIMIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
11 patentsUS6304527B1Oct 16, 2001
Near-field optical head and manufacturing method thereof and optical recording/readout system using near-field optical head
HITACHI LTD71 citations96
US5796706AAug 18, 1998
Information recording apparatus
HITACHI LTD59 citations96
US6683823B2Jan 27, 2004
Method for reproducing information on a recording medium
HITACHI LTD22 citations93
US7864475B2Jan 4, 2011
Thermally assisted magnetic recording system and thermally assisted magnetic recording
HITACHI LTD7 citations84
US6930846B2Aug 16, 2005
Magnetic recording apparatus and system for driving a magnetic recording medium
HITACHI LTD8 citations74
US7898908B2Mar 1, 2011
Head for thermally assisted magnetic recording device and thermally assisted magnetic recording device
HITACHI LTD3 citations63
US7804743B2Sep 28, 2010
Thermally assisted magnetic recording head and method of manufacturing the same
HITACHI LTD4 citations63
US6560168B1May 6, 2003
Information recording/reproducing device
HITACHI LTD6 citations63
US6298029B1Oct 2, 2001
Information recording and reproducing apparatus and methods of recording and reproducing information using solid immersion lens having super resolution film deposited thereon
HITACHI LTD3 citations63
US7773331B2Aug 10, 2010
Thermally assisted magnetic recording system
HITACHI LTD6 citations62
US6744249B2Jun 1, 2004
Method and instrument for measuring a magnetic field, a method for measuring a current waveform, and method for measuring an electric field
HITACHI LTD1 citations51
FUJITSU LTD
8 patentsUS7566586B2Jul 28, 2009
Method of manufacturing a semiconductor device
FUJITSU LTD7 citations73
US7670873B2Mar 2, 2010
Method of flip-chip mounting
FUJITSU LTD3 citations63
US8381963B2Feb 26, 2013
Compression-bonding apparatus
FUJITSU LTD4 citations62
US7712650B2May 11, 2010
Method of mounting a semiconductor chip
FUJITSU LTD1 citations52
US7582553B2Sep 1, 2009
Method of bonding flying leads
FUJITSU LTD0 citations52
US7367108B2May 6, 2008
Method of bonding flying leads
FUJITSU LTD0 citations52
US9391031B2Jul 12, 2016
Method for manufacturing electronic device and electronic device
FUJITSU LTD0 citations42
US7416921B2Aug 26, 2008
Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin
FUJITSU LTD0 citations42