Inventor

SHINTATE TSUYOSHI

JP15 patents

⚠️ This page may combine multiple inventors who share the name “SHINTATE TSUYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEIKO EPSON CORP

13 patents

US7416759B2Aug 26, 2008

Wiring pattern formation method, wiring pattern, and electronic device

SEIKO EPSON CORP13 citations83

US7767252B2Aug 3, 2010

Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatus

SEIKO EPSON CORP2 citations62

US7250377B2Jul 31, 2007

Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus

SEIKO EPSON CORP4 citations62

US7793411B2Sep 14, 2010

Method for manufacturing electronic substrate

SEIKO EPSON CORP2 citations61

US7538031B2May 26, 2009

Method of manufacturing a wiring substrate and an electronic instrument

SEIKO EPSON CORP2 citations61

US7316974B2Jan 8, 2008

Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device

SEIKO EPSON CORP2 citations61

US7871666B2Jan 18, 2011

Pattern forming system, pattern forming method, and electronic apparatus

SEIKO EPSON CORP0 citations51

US7723243B2May 25, 2010

Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus

SEIKO EPSON CORP0 citations51

US7629019B2Dec 8, 2009

Method for forming wiring pattern, wiring pattern, and electronic apparatus

SEIKO EPSON CORP0 citations51

US7462241B2Dec 9, 2008

Pattern forming system, pattern forming method, and electronic apparatus

SEIKO EPSON CORP1 citations51

US7972651B2Jul 5, 2011

Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus

SEIKO EPSON CORP0 citations41

US7541063B2Jun 2, 2009

Method for forming layer

SEIKO EPSON CORP0 citations41

US7805836B2Oct 5, 2010

Manufacturing method of electronic board and multilayer wiring board

SEIKO EPSON CORP0 citations40

HIRAI TOSHIMITSU

1 patent

US8322033B2Dec 4, 2012

Method for forming a conductive post for a multilayered wiring substrate

HIRAI TOSHIMITSU0 citations46

SHINTATE TSUYOSHI

1 patent

US8888229B2Nov 18, 2014

Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate

SHINTATE TSUYOSHI0 citations34