Inventor
WU JENG-DA
TW28 patents
⚠️ This page may combine multiple inventors who share the name “WU JENG-DA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
10 patentsUS7199479B2Apr 3, 2007
Chip package structure and process for fabricating the same
ADVANCED SEMICONDUCTOR ENG22 citations92
US6864168B2Mar 8, 2005
Bump and fabricating process thereof
ADVANCED SEMICONDUCTOR ENG25 citations92
US6819002B2Nov 16, 2004
Under-ball-metallurgy layer
ADVANCED SEMICONDUCTOR ENG28 citations92
US7407833B2Aug 5, 2008
Process for fabricating chip package structure
ADVANCED SEMICONDUCTOR ENG11 citations84
US6891274B2May 10, 2005
Under-bump-metallurgy layer for improving adhesion
ADVANCED SEMICONDUCTOR ENG6 citations73
US7633169B2Dec 15, 2009
Chip package structure
ADVANCED SEMICONDUCTOR ENG3 citations62
US7482204B2Jan 27, 2009
Chip packaging process
ADVANCED SEMICONDUCTOR ENG4 citations61
US7335982B2Feb 26, 2008
Chip package structure and chip packaging process
ADVANCED SEMICONDUCTOR ENG2 citations61
US6972489B2Dec 6, 2005
Flip chip package with thermometer
ADVANCED SEMICONDUCTOR ENG2 citations59
US7042078B2May 9, 2006
Semiconductor package
ADVANCED SEMICONDUCTOR ENG0 citations52
HONGFUJIN PREC IND SHENZHEN
7 patentsUS7835149B2Nov 16, 2010
Computer enclosure with airflow guide
HONGFUJIN PREC IND SHENZHEN19 citations91
US7760498B2Jul 20, 2010
Electronic apparatus with air guiding element
HONGFUJIN PREC IND SHENZHEN26 citations91
US7675753B2Mar 9, 2010
Mounting apparatus for heat sink
HONGFUJIN PREC IND SHENZHEN13 citations84
US7929304B2Apr 19, 2011
Heat dissipation apparatus
HONGFUJIN PREC IND SHENZHEN9 citations83
US7864536B2Jan 4, 2011
Circuit board assembly
HONGFUJIN PREC IND SHENZHEN2 citations62
US7447014B2Nov 4, 2008
Bracket assembly for disk drive and a method of assembling a bracket to an enclosure for preventing resonance
HONGFUJIN PREC IND SHENZHEN0 citations51
US7763817B2Jul 27, 2010
Button assembly
HONGFUJIN PREC IND SHENZHEN0 citations41
HON HAI PREC IND CO LTD
7 patentsUS7663063B2Feb 16, 2010
Circuit board with improved ground plane
HON HAI PREC IND CO LTD8 citations83
US7996169B2Aug 9, 2011
Method and apparatus for compensating S-parameters of passive circuits
HON HAI PREC IND CO LTD4 citations62
US7447039B2Nov 4, 2008
Motherboard configured to minimize or prevent damage to a chip thereon
HON HAI PREC IND CO LTD4 citations62
US7606119B2Oct 20, 2009
Objective lens actuator
HON HAI PREC IND CO LTD1 citations52
US7451466B2Nov 11, 2008
Feeding mechanism for pickup head
HON HAI PREC IND CO LTD0 citations51
US7973244B2Jul 5, 2011
Printed circuit board
HON HAI PREC IND CO LTD1 citations49
US8035034B2Oct 11, 2011
Printed circuit board
HON HAI PREC IND CO LTD0 citations41