Inventor
HSIEH HUNG CHANG
TW84 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH HUNG CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
20 patentsUS9304403B2Apr 5, 2016
System and method for lithography alignment
TAIWAN SEMICONDUCTOR MFG64 citations98
US8975129B1Mar 10, 2015
Method of making a FinFET device
TAIWAN SEMICONDUCTOR MFG60 citations98
US6319821B1Nov 20, 2001
Dual damascene approach for small geometry dimension
TAIWAN SEMICONDUCTOR MFG66 citations96
US6174818B1Jan 16, 2001
Method of patterning narrow gate electrode
TAIWAN SEMICONDUCTOR MFG77 citations96
US9153483B2Oct 6, 2015
Method of semiconductor integrated circuit fabrication
TAIWAN SEMICONDUCTOR MFG28 citations94
US9034723B1May 19, 2015
Method of making a FinFET device
TAIWAN SEMICONDUCTOR MFG28 citations94
US6362093B1Mar 26, 2002
Dual damascene method employing sacrificial via fill layer
TAIWAN SEMICONDUCTOR MFG35 citations93
US6352818B1Mar 5, 2002
Photoresist development method employing multiple photoresist developer rinse
TAIWAN SEMICONDUCTOR MFG40 citations93
US6312876B1Nov 6, 2001
Method for placing identifying mark on semiconductor wafer
TAIWAN SEMICONDUCTOR MFG32 citations93
US5894350AApr 13, 1999
Method of in line intra-field correction of overlay alignment
TAIWAN SEMICONDUCTOR MFG49 citations93
US7383530B2Jun 3, 2008
System and method for examining mask pattern fidelity
TAIWAN SEMICONDUCTOR MFG27 citations92
US6242813B1Jun 5, 2001
Deep-submicron integrated circuit package for improving bondability
TAIWAN SEMICONDUCTOR MFG32 citations92
US6110816AAug 29, 2000
Method for improving bondability for deep-submicron integrated circuit package
TAIWAN SEMICONDUCTOR MFG19 citations92
US6090674AJul 18, 2000
Method of forming a hole in the sub quarter micron range
TAIWAN SEMICONDUCTOR MFG16 citations84
US6570642B2May 27, 2003
Method and apparatus for placing identifying mark on semiconductor wafer
TAIWAN SEMICONDUCTOR MFG6 citations74
US6350680B1Feb 26, 2002
Pad alignment for AlCu pad for copper process
TAIWAN SEMICONDUCTOR MFG12 citations74
US9158209B2Oct 13, 2015
Method of overlay prediction
TAIWAN SEMICONDUCTOR MFG5 citations73
US9349662B2May 24, 2016
Test structure placement on a semiconductor wafer
TAIWAN SEMICONDUCTOR MFG5 citations69
US9176387B2Nov 3, 2015
Method and apparatus for drying a wafer
TAIWAN SEMICONDUCTOR MFG2 citations63
US7897297B2Mar 1, 2011
Method and system for optimizing intra-field critical dimension uniformity using a sacrificial twin mask
TAIWAN SEMICONDUCTOR MFG3 citations63
TAIWAN SEMICONDUCTOR MFG CO LTD
17 patentsUS9875892B2Jan 23, 2018
Method of forming a photoresist layer
TAIWAN SEMICONDUCTOR MFG CO LTD70 citations97
US9711367B1Jul 18, 2017
Semiconductor method with wafer edge modification
TAIWAN SEMICONDUCTOR MFG CO LTD23 citations92
US10459353B2Oct 29, 2019
Lithography system with an embedded cleaning module
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10096519B2Oct 9, 2018
Method of making a FinFET device
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US9799567B2Oct 24, 2017
Method of forming source/drain contact
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US9437497B2Sep 6, 2016
Method of making a FinFET device
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations80
US10672656B2Jun 2, 2020
Method of semiconductor integrated circuit fabrication
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9466486B2Oct 11, 2016
Method for integrated circuit patterning
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US11081394B2Aug 3, 2021
Method of making a FinFET device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10163720B2Dec 25, 2018
Method of forming source/drain contact
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9823574B2Nov 21, 2017
Lithography alignment marks
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9703918B2Jul 11, 2017
Two-dimensional process window improvement
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US9805154B2Oct 31, 2017
Method of lithography process with inserting scattering bars
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations68
US9443768B2Sep 13, 2016
Method of making a FinFET device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US11735477B2Aug 22, 2023
Method of semiconductor integrated circuit fabrication
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11378894B2Jul 5, 2022
Lithography system with an embedded cleaning module
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US8972912B1Mar 3, 2015
Structure for chip extension
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
DELTA ELECTRONICS INC
6 patentsUS7589970B2Sep 15, 2009
Assembled structure of power semiconductor device and heat sink
DELTA ELECTRONICS INC13 citations84
US6930883B2Aug 16, 2005
Heat-dispersing module of electronic device
DELTA ELECTRONICS INC12 citations82
US6995979B2Feb 7, 2006
Heat-dissipating fan module of electronic apparatus
DELTA ELECTRONICS INC12 citations80
US7335048B1Feb 26, 2008
Electrical connector having latching mechanism
DELTA ELECTRONICS INC7 citations71
US7972163B2Jul 5, 2011
Electrical connector having latching mechanism
DELTA ELECTRONICS INC2 citations62
US7780481B2Aug 24, 2010
Composite connector assembly and power supply apparatus having such composite connector assembly
DELTA ELECTRONICS INC3 citations62
CHANG CHUN-WEI
1 patentWANG CHIH-CHIEN
1 patentLAN SHUN-WEI
1 patentYU VINVENT
1 patentYU VINCENT
1 patentLEE HSIN-CHANG
1 patentHUANG WEI-CHIEH
1 patentShowing the top 50 of 84 patents by PatentIndex Score.