Inventor
HA JEONGKYU
KR4 patents
Patents
4 patentsUS12148337B2Nov 19, 2024
Chip on film package with trench to reduce slippage and display device including the same
SAMSUNG ELECTRONICS CO LTD0 citations58
US12230576B2Feb 18, 2025
Chip-on-film package and display apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US12085990B2Sep 10, 2024
Chip-on-film package, display module including same, and electronic device including same
SAMSUNG ELECTRONICS CO LTD0 citations53
US11836006B2Dec 5, 2023
Chip-on-film package, display module including same, and electronic device including same
SAMSUNG ELECTRONICS CO LTD0 citations53