Inventor

LEE TOM C

US75 patents

⚠️ This page may combine multiple inventors who share the name “LEE TOM C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE TOM C

IBM

Design structures for high-voltage integrated circuits

Structure and method for monitoring stress-induced degradation of conductive interconnects

Semiconductor wafer processing method that allows device regions to be selectively annealed following back end of the line (BEOL) metal wiring layer formation

Fuse link structures using film stress for programming and methods of manufacture

Heat dissipation for heat generating element of semiconductor device and related method

Electrostatic discharge and passive structures integrated in a vertical gate fin-type field effect diode

SCR with fin body regions for ESD protection

Dual three-dimensional (3D) resistor and methods of forming

Silicon controlled rectifier with integral deep trench capacitor

Silicon controlled rectifier with integral deep trench capacitor

Bi-directional back-to-back stacked SCR for high-voltage pin ESD protection, methods of manufacture and design structures

Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devices

Semiconductor device heat dissipation structure

Bulk FinFET ESD device

Optoelectronic memory devices

Structure and programming of laser fuse

Semiconductor structure with thin film resistor and terminal bond pad

Through silicon via repair

Design structure for semiconductor on-chip repair scheme for negative bias temperature instability

E-fuse used to disable a triggering network

Semiconductor on-chip repair scheme for negative bias temperature instability

Electromigration resistant aluminum-based metal interconnect structure

Programming of laser fuse

Structure for monitoring stress-induced degradation of conductive interconnects

Structure and programming of laser fuse

IC chip stress testing

Structures, methods and applications for electrical pulse anneal processes

Structures, methods and applications for electrical pulse anneal processes

ABOU-KHALIL MICHEL J

Metal-insulator-metal capacitors with high capacitance density

RC-triggered semiconductor controlled rectifier for ESD protection of signal pads

Structures, methods and applications for electrical pulse anneal processes

Semiconductor structures with thinned junctions and methods of manufacture

Programmable electrical fuse

Bi-directional back-to-back stacked SCR for high-voltage pin ESD protection, methods of manufacture and design structures

Semiconductor device heat dissipation structure

Semiconductor-on-insulator device structures with a body-to-substrate connection for enhanced electrostatic discharge protection, and design structures for such semiconductor-on-insulator device structures

GLOBALFOUNDRIES INC

Electrostatic discharge protection circuit with a fail-safe mechanism

Edge compression layers

Self-healing electrostatic discharge power clamp

Electrostatic discharge and passive structures integrated in a vertical gate fin-type field effect diode

CHEN FEN

Method for forming thin film resistor and terminal bond pad simultaneously

Optoelectronic memory devices

BARTH KARL W

Fuse link structures using film stress for programming and methods of manufacture

Fuse link structures using film stress for programming and methods of manufacture

DI SARRO JAMES P

Non-planar capacitor and method of forming the non-planar capacitor

RC-triggered ESD clamp device with feedback for time constant adjustment

GAMBINO JEFFREY P

Fuse structure having crack stop void, method for forming and programming same, and design structure

COONEY III EDWARD C

Thick on-chip high-performance wiring structures

LEE TOM C

Electrical fuse with a current shunt

CHRISTIANSEN CATHRYN J

Thermal sensor for semiconductor circuits