Inventor
JANG CHUL-YONG
KR17 patents
⚠️ This page may combine multiple inventors who share the name “JANG CHUL-YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS7807512B2Oct 5, 2010
Semiconductor packages and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD115 citations97
US9640513B2May 2, 2017
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD15 citations84
US9281235B2Mar 8, 2016
Semiconductor packages and methods of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US9627327B2Apr 18, 2017
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US12406895B2Sep 2, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations69
US9159705B2Oct 13, 2015
Semiconductor chip connecting semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations62
US8344497B2Jan 1, 2013
Semiconductor package and electronic device having the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US8008771B2Aug 30, 2011
Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device
SAMSUNG ELECTRONICS CO LTD4 citations62
US7759795B2Jul 20, 2010
Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD2 citations58
US9570423B2Feb 14, 2017
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations51
US9364914B2Jun 14, 2016
Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball
SAMSUNG ELECTRONICS CO LTD0 citations51
US7898075B2Mar 1, 2011
Semiconductor package having resin substrate with recess and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations47