Inventor

AHN EUN-CHUL

KR23 patents

⚠️ This page may combine multiple inventors who share the name “AHN EUN-CHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AHN EUN-CHUL

SAMSUNG ELECTRONICS CO LTD

Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

Stacked chip package with heat transfer wires

Semiconductor device having fuse pattern

Semiconductor package using chip-embedded interposer substrate

Semiconductor package embedded in substrate, system including the same and associated methods

BGA package and method of manufacturing the same

Semiconductor package and electronic device having the same

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Stacked semiconductor package having reduced height

Method of fabricating a 3-D device

Method of fabricating electronic device having stacked chips

Flip-chip assembly and method of manufacturing the same

Semiconductor device having fuse pattern

Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same

Semiconductor package having resin substrate with recess and method of fabricating the same

HWANG TAE-JOO

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

Semiconductor package and method of forming the same

PARK JIN-WOO

Integrated circuit chip and flip chip package having the integrated circuit chip

SHIN CHANG-WOO

Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same