Inventor
KIM PYOUNG-WAN
KR16 patents
⚠️ This page may combine multiple inventors who share the name “KIM PYOUNG-WAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS7807512B2Oct 5, 2010
Semiconductor packages and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD115 citations97
US7148080B2Dec 12, 2006
Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package
SAMSUNG ELECTRONICS CO LTD19 citations89
US7521810B2Apr 21, 2009
Chip stack package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD9 citations84
US8373261B2Feb 12, 2013
Chip stack package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD9 citations83
US6946328B2Sep 20, 2005
Method for manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD17 citations83
US6498389B1Dec 24, 2002
Ultra-thin semiconductor package device using a support tape
SAMSUNG ELECTRONICS CO LTD18 citations83
US7626254B2Dec 1, 2009
Semiconductor package using chip-embedded interposer substrate
SAMSUNG ELECTRONICS CO LTD9 citations82
US9793309B2Oct 17, 2017
Image sensor package
SAMSUNG ELECTRONICS CO LTD5 citations69
US8344497B2Jan 1, 2013
Semiconductor package and electronic device having the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US8008771B2Aug 30, 2011
Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device
SAMSUNG ELECTRONICS CO LTD4 citations62
US7498679B2Mar 3, 2009
Package substrate and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD4 citations54
US10105102B2Oct 23, 2018
Package for processing sensed-data, sensed-data processor, and system for processing sensed-data
SAMSUNG ELECTRONICS CO LTD1 citations51
US7898075B2Mar 1, 2011
Semiconductor package having resin substrate with recess and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations47