Inventor
WONG HUEI-SIANG
TW7 patents
Patents
7 patentsUS11600590B2Mar 7, 2023
Semiconductor device and semiconductor package
ADVANCED SEMICONDUCTOR ENG3 citations69
US10818627B2Oct 27, 2020
Electronic component including a conductive pillar and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations69
US11535509B2Dec 27, 2022
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations60
US11437292B2Sep 6, 2022
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations60
US11776887B2Oct 3, 2023
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations59
US11427466B2Aug 30, 2022
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations50
US12094772B2Sep 17, 2024
Electronic device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations48