Inventor
WOETZEL STEFAN
DE6 patents
Patents
6 patentsUS11676879B2Jun 13, 2023
Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier
INFINEON TECHNOLOGIES AG2 citations69
US11984392B2May 14, 2024
Semiconductor package having a chip carrier with a pad offset feature
INFINEON TECHNOLOGIES AG0 citations60
US12412797B2Sep 9, 2025
Hybrid embedded package
INFINEON TECHNOLOGIES AG0 citations59
US11521907B2Dec 6, 2022
Hybrid embedded package
INFINEON TECHNOLOGIES AG0 citations59
US11710684B2Jul 25, 2023
Package with separate substrate sections
INFINEON TECHNOLOGIES AG0 citations51
US12283538B2Apr 22, 2025
Molded semiconductor package having an embedded inlay
INFINEON TECHNOLOGIES AG0 citations46