Inventor
HAYASAKA NOBORU
JP26 patents
⚠️ This page may combine multiple inventors who share the name “HAYASAKA NOBORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YAZAKI CORP
13 patentsUS10461480B1Oct 29, 2019
Shield connector
YAZAKI CORP7 citations80
US10505319B2Dec 10, 2019
Device direct-mounting shield connector
YAZAKI CORP4 citations73
US10069241B2Sep 4, 2018
Fitting connector
YAZAKI CORP5 citations73
US10971854B2Apr 6, 2021
Shielded connector
YAZAKI CORP3 citations72
US10847918B2Nov 24, 2020
Fitting connector
YAZAKI CORP2 citations72
US10027054B2Jul 17, 2018
Connector having integrated housing and shield shell
YAZAKI CORP6 citations71
US11121501B2Sep 14, 2021
Connector having structure for separating connector from connection target
YAZAKI CORP1 citations59
US11005208B2May 11, 2021
Connector and wire harness
YAZAKI CORP0 citations59
US11005216B2May 11, 2021
Connector and connector structure
YAZAKI CORP1 citations59
US12266882B2Apr 1, 2025
Connector including terminal fitting embedded in housing and manufacturing method of connector including terminal fitting embedded in housing
YAZAKI CORP0 citations47
US10236639B2Mar 19, 2019
Attachment structure of shield connector for directly mounting on device
YAZAKI CORP0 citations42
US10770834B2Sep 8, 2020
Fitting connector
YAZAKI CORP0 citations40
US10044149B2Aug 7, 2018
Female and male connectors
YAZAKI CORP0 citations40
FUJITSU LTD
7 patentsUS6750074B2Jun 15, 2004
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD13 citations92
US7056770B2Jun 6, 2006
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
FUJITSU LTD19 citations89
US7395847B2Jul 8, 2008
Jig for a semiconductor substrate
FUJITSU LTD9 citations84
US7109561B2Sep 19, 2006
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD4 citations73
US6902944B2Jun 7, 2005
Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
FUJITSU LTD5 citations73
US7157311B2Jan 2, 2007
Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices
FUJITSU LTD5 citations62
US6951800B2Oct 4, 2005
Method of making semiconductor device that has improved structural strength
FUJITSU LTD1 citations52
SANYO ELECTRIC CO
2 patentsUS5588120ADec 24, 1996
Communication control system for transmitting, from one data processing device to another, data of different formats along with an identification of the format and its corresponding DMA controller
SANYO ELECTRIC CO10 citations68
US5430844AJul 4, 1995
Communication control system for transmitting, from one data processing device to another, data along with an identification of the address at which the data is to be stored upon reception
SANYO ELECTRIC CO13 citations66