Inventor

CHAOWASAKOO TANAWAN

TH2 patents

Patents

2 patents

US11145575B2Oct 12, 2021

Conductive bonding layer with spacers between a package substrate and chip

UTAC HEADQUARTERS PTE LTD2 citations63

US11710681B2Jul 25, 2023

Semiconductor packages and methods of packaging semiconductor devices

UTAC HEADQUARTERS PTE LTD0 citations53