Inventor
JAENGKRAJARNG THANAWAT
TH3 patents
Patents
3 patentsUS11145575B2Oct 12, 2021
Conductive bonding layer with spacers between a package substrate and chip
UTAC HEADQUARTERS PTE LTD2 citations63
US11710681B2Jul 25, 2023
Semiconductor packages and methods of packaging semiconductor devices
UTAC HEADQUARTERS PTE LTD0 citations53
US11804416B2Oct 31, 2023
Semiconductor device and method of forming protective layer around cavity of semiconductor die
UTAC HEADQUARTERS PTE LTD0 citations48