Inventor

Song wei-wei

US2 patents

Patents

2 patents

US11966090B2Apr 23, 2024

Heterogeneous packaging integration of photonic and electronic elements

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations57

US12181724B2Dec 31, 2024

Apparatus and methods for optical interconnects

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48