P

Inventor

HAYASHI YOSHIHIRO

JP243 patents
⚠️ This page may combine multiple inventors who share the name “HAYASHI YOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

24 patents
US5087585AFeb 11, 1992

Method of stacking semiconductor substrates for fabrication of three-dimensional integrated circuit

NEC CORP520 citations99
US4998665AMar 12, 1991

Bonding structure of substrates and method for bonding substrates

NEC CORP180 citations99
US6379230B1Apr 30, 2002

Automatic polishing apparatus capable of polishing a substrate with a high planarization

NEC CORP103 citations98
US6146906ANov 14, 2000

DC magnetron sputtering method for manufacturing electrode of ferroelectric capacitor

NEC CORP100 citations98
US6538324B1Mar 25, 2003

Multi-layered wiring layer and method of fabricating the same

NEC CORP65 citations96
US6165056ADec 26, 2000

Polishing machine for flattening substrate surface

NEC CORP63 citations96
US6077437AJun 20, 2000

Device and method for recovering and reusing a polishing agent

NEC CORP90 citations96
US5906532AMay 25, 1999

Method for polishing semiconductor substrate and apparatus for the same

NEC CORP78 citations96
US5880003AMar 9, 1999

Method of giving a substantially flat surface of a semiconductor device through a polishing operation

NEC CORP66 citations96
US5717251AFeb 10, 1998

Semiconductor integrated circuit device having minature multi-level wiring structure low in parasitic capacitance

NEC CORP80 citations96
US5626509AMay 6, 1997

Surface treatment of polishing cloth

NEC CORP95 citations96
US6270392B1Aug 7, 2001

Polishing apparatus and method with constant polishing pressure

NEC CORP48 citations95
US6004839ADec 21, 1999

Semiconductor device with conductive plugs

NEC CORP60 citations94
US7101591B2Sep 5, 2006

Production method for copolymer film, copolymer film produced by the forming method and semiconductor device using copolymer film

NEC CORP26 citations93
US6784118B2Aug 31, 2004

Method for vaporization of liquid organic feedstock and method for growth of insulation film

NEC CORP27 citations93
US6344693B1Feb 5, 2002

Semiconductor device and method for manufacturing same

NEC CORP38 citations93
US6300212B1Oct 9, 2001

Method of fabricating semiconductor device having memory capacitor including ferroelectric layer made of composite metal oxide

NEC CORP36 citations93
US5880024AMar 9, 1999

Semiconductor device having wiring self-aligned with shield structure and process of fabrication thereof

NEC CORP22 citations93
US5688720ANov 18, 1997

Method of flattening the surface of a semiconductor device by polishing

NEC CORP28 citations93
US5643837AJul 1, 1997

Method of flattening the surface of a semiconductor device by polishing

NEC CORP37 citations93
US5603654AFeb 18, 1997

Method for supplying a polishing liquid and polishing method using the same

NEC CORP19 citations93
US5550427AAug 27, 1996

Substrate contact electrode having refractory metal bump structure with reinforcement sidewall film

NEC CORP27 citations93
US7701060B2Apr 20, 2010

Wiring structure and method for manufacturing the same

NEC CORP20 citations92
US7545040B2Jun 9, 2009

Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device

NEC CORP25 citations92

RENESAS TECH CORP

6 patents

HITACHI LTD

6 patents

RENESAS ELECTRONICS CORP

4 patents

OLYMPUS OPTICAL CO

2 patents

OLYMPUS CORP

2 patents

TOKAI RIKA CO LTD

1 patent

BECKMAN COULTER INC

1 patent

KURITA WATER IND LTD

1 patent

KANEKO KISHOU

1 patent

UEKI MAKOTO

1 patent

AIKOH CO

1 patent

Showing the top 50 of 243 patents by PatentIndex Score.