Inventor
RUMSEY ROBERT
US3 patents
Patents
3 patentsUS6900538B2May 31, 2005
Integrating chip scale packaging metallization into integrated circuit die structures
MICREL INC15 citations81
US7979813B2Jul 12, 2011
Chip-scale package conversion technique for dies
MICREL INC15 citations76
US7211893B2May 1, 2007
Integrating chip scale packaging metallization into integrated circuit die structures
MICREL INC4 citations59