Inventor
KUO NICK
TW3 patents
Patents
3 patentsUS7855461B2Dec 21, 2010
Chip structure with bumps and testing pads
MEGICA CORP19 citations91
US7394161B2Jul 1, 2008
Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto
MEGICA CORP24 citations91
US7977803B2Jul 12, 2011
Chip structure with bumps and testing pads
MEGICA CORP3 citations61