Inventor

NA GUICHEA

KR3 patents

⚠️ This page may combine multiple inventors who share the name “NA GUICHEA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PENDSE RAJENDRA D

1 patent

US9125332B2Sep 1, 2015

Filp chip interconnection structure with bump on partial pad and method thereof

PENDSE RAJENDRA D5 citations81

STATS CHIPPAC LTD

1 patent

US7759137B2Jul 20, 2010

Flip chip interconnection structure with bump on partial pad and method thereof

STATS CHIPPAC LTD1 citations49

NA GUICHEA

1 patent

US8592989B2Nov 26, 2013

Integrated circuit package system with bump over via

NA GUICHEA0 citations36