Inventor
CHEN YANFENG
CN23 patents
⚠️ This page may combine multiple inventors who share the name “CHEN YANFENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLE INC
8 patentsUS9899661B2Feb 20, 2018
Method to improve LiCoO2 morphology in thin film batteries
APPLE INC8 citations84
US10356903B1Jul 16, 2019
System-in-package including opposing circuit boards
APPLE INC9 citations81
US11266010B2Mar 1, 2022
Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
APPLE INC3 citations71
US9949359B2Apr 17, 2018
Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
APPLE INC4 citations71
US9913412B2Mar 6, 2018
Shielding structures for system-in-package assemblies in portable electronic devices
APPLE INC2 citations71
US10709018B2Jul 7, 2020
System-in-package including opposing circuit boards
APPLE INC3 citations70
US10966321B2Mar 30, 2021
System-in-package including opposing circuit boards
APPLE INC0 citations59
US10147685B2Dec 4, 2018
System-in-package devices with magnetic shielding
APPLE INC0 citations50
NANJING UNIVERSITY OF TECHNOLOGY
2 patentsUS9316903B2Apr 19, 2016
Flexible nanoimprint mold, method for fabricating the same, and mold usage on planar and curved substrate
NANJING UNIVERSITY OF TECHNOLOGY3 citations69
US9676123B2Jun 13, 2017
Flexible nanoimprint mold, method for fabricating the same, and mold usage on planar and curved substrate
NANJING UNIVERSITY OF TECHNOLOGY1 citations59
CHEN YANFENG
2 patentsUS9018100B2Apr 28, 2015
Damascene process using PVD sputter carbon film as CMP stop layer for forming a magnetic recording head
CHEN YANFENG2 citations57
US8871048B2Oct 28, 2014
Flexible nanoimprint mold, method for fabricating the same, and mold usage on planar and curved substrate
CHEN YANFENG3 citations57