Inventor
TRZCINSKI ROBERT E
US19 patents
⚠️ This page may combine multiple inventors who share the name “TRZCINSKI ROBERT E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
14 patentsUS9029238B2May 12, 2015
Advanced handler wafer bonding and debonding
IBM26 citations92
US7518850B2Apr 14, 2009
High yield, high density on-chip capacitor design
IBM19 citations92
US7939910B2May 10, 2011
Structure for symmetrical capacitor
IBM11 citations84
US7859825B2Dec 28, 2010
High yield, high density on-chip capacitor design
IBM10 citations84
US7838384B2Nov 23, 2010
Structure for symmetrical capacitor
IBM8 citations84
US7816197B2Oct 19, 2010
On-chip adjustment of MIMCAP and VNCAP capacitors
IBM7 citations73
US10168478B2Jan 1, 2019
Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology
IBM4 citations72
US9632251B2Apr 25, 2017
Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology
IBM4 citations72
US7579644B2Aug 25, 2009
Adjustable on-chip sub-capacitor design
IBM3 citations63
US7504705B2Mar 17, 2009
Striped on-chip inductor
IBM4 citations63
US9897627B2Feb 20, 2018
Test probe substrate
IBM0 citations52
US9851379B2Dec 26, 2017
Test probe substrate
IBM0 citations52
US9606142B2Mar 28, 2017
Test probe substrate
IBM0 citations52
US10168477B2Jan 1, 2019
Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology
IBM0 citations51