Inventor
COVELL JAMES H
US8 patents
Patents
8 patentsUS6278193B1Aug 21, 2001
Optical sensing method to place flip chips
IBM95 citations96
US6333209B1Dec 25, 2001
One step method for curing and joining BGA solder balls
IBM27 citations91
US6276596B1Aug 21, 2001
Low temperature solder column attach by injection molded solder and structure formed
IBM54 citations91
US6964885B2Nov 15, 2005
Stress resistant land grid array (LGA) module and method of forming the same
IBM9 citations71
US6703560B2Mar 9, 2004
Stress resistant land grid array (LGA) module and method of forming the same
IBM7 citations71
US7806312B2Oct 5, 2010
Method and apparatus for removing known good die
IBM0 citations51
US7168609B2Jan 30, 2007
Method and apparatus for removing known good die
IBM0 citations51
US7989229B2Aug 2, 2011
Tactile surface inspection during device fabrication or assembly
IBM0 citations50