Inventor

CHU YUNG-KANG

TW2 patents

Patents

2 patents

US6593658B2Jul 15, 2003

Chip package capable of reducing moisture penetration

SILICONWARE PRECISION INDUSTRIES CO LTD25 citations90

US6740978B2May 25, 2004

Chip package capable of reducing moisture penetration

SILICONWARE PRECISION INDUSTRIES CO LTD5 citations60