Inventor
HUANG LIU
SG15 patents
⚠️ This page may combine multiple inventors who share the name “HUANG LIU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
6 patentsUS6787452B2Sep 7, 2004
Use of amorphous carbon as a removable ARC material for dual damascene fabrication
CHARTERED SEMICONDUCTOR MFG51 citations92
US7052932B2May 30, 2006
Oxygen doped SiC for Cu barrier and etch stop layer in dual damascene fabrication
CHARTERED SEMICONDUCTOR MFG28 citations90
US7538353B2May 26, 2009
Composite barrier/etch stop layer comprising oxygen doped SiC and SiC for interconnect structures
CHARTERED SEMICONDUCTOR MFG11 citations81
US7186640B2Mar 6, 2007
Silicon-rich oxide for copper damascene interconnect incorporating low dielectric constant dielectrics
CHARTERED SEMICONDUCTOR MFG7 citations74
US6872633B2Mar 29, 2005
Deposition and sputter etch approach to extend the gap fill capability of HDP CVD process to ≦0.10 microns
CHARTERED SEMICONDUCTOR MFG11 citations73
US7148157B2Dec 12, 2006
Use of phoslon (PNO) for borderless contact fabrication, etch stop/barrier layer for dual damascene fabrication and method of forming phoslon
CHARTERED SEMICONDUCTOR MFG3 citations60
CISCO TECH INC
2 patentsGLOBALFOUNDRIES SG PTE LTD
2 patentsUNIV DALIAN TECH
2 patentsUS11767455B2Sep 26, 2023
Superhydrophobic hemispherical array which can realize droplet pancake bouncing phenomenon
UNIV DALIAN TECH0 citations56
US11104043B2Aug 31, 2021
Thermal extrusion method to fabricate large-dimension superhydrophobic cylinder pillar arrays with droplet pancake bouncing phenomenon
UNIV DALIAN TECH0 citations48