Inventor
ODA TAKAMASA
JP4 patents
Patents
4 patentsUS11257760B2Feb 22, 2022
Semiconductor device having metal wire bonded to plural metal blocks connected to respective circuit patterns
MITSUBISHI ELECTRIC CORP2 citations71
US10593605B2Mar 17, 2020
Semiconductor package
MITSUBISHI ELECTRIC CORP2 citations69
US11876033B2Jan 16, 2024
Semiconductor device including resin case having groove at corner thereof
MITSUBISHI ELECTRIC CORP0 citations49
US12243790B2Mar 4, 2025
Semiconductor device and inverter device
MITSUBISHI ELECTRIC CORP0 citations47