Inventor

HWANG JUN-SIK

KR71 patents

⚠️ This page may combine multiple inventors who share the name “HWANG JUN-SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HWANG JUN-SIK

HYUNDAI MOTOR CO LTD

Apparatus and method for controlling speed in cooperative adaptive cruise control system

Vehicle seat adjustment device

Multi-position seat

Device for tilting seat cushion of fold and dive seat

Seat adjustment apparatus for vehicle

Vehicle rear seat

Vehicle seat reinforcement device

Seat for vehicle with cushion tip-up and down function

Seat for vehicle

Cooperative adaptive cruise control system based on driving pattern of target vehicle

Apparatus and method for controlling speed in cooperative adaptive cruise control system

Cooperative adaptive cruise control system based on driving pattern of target vehicle

Rear seat for vehicle

Device for adjusting seat of vehicle

Vehicle seat

Seat for vehicle

Seat adjustment apparatus for mobility

SAMSUNG ELECTRONICS CO LTD

Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package

Duplexer using an embedded PCB and method of fabricating the same

Wafer level package for surface acoustic wave device and fabrication method thereof

Wafer level package for surface acoustic wave device and fabrication method thereof

Wafer level packaging cap and fabrication method thereof

High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor

Packaging chip and packaging method thereof

Magnetic field detecting element and method for manufacturing the same

RF module with multi-stack structure

Method for manufacturing a film bulk acoustic resonator

Multi stack packaging chip and method of manufacturing the same

Air-gap type FBAR, method for fabricating the same, and filter and duplexer using the same

Film bulk acoustic resonator and method for manufacturing the same

Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package

Wafer level packaging cap and fabrication method thereof

Cap for semiconductor device package, and manufacturing method thereof

AMOGREENTECH CO LTD

Filter medium for liquid filter and method for manufacturing same

Waterproof sound-permitting sheet, method of manufacturing same, and electronic device provided with waterproof sound-permitting sheet

Filter medium, manufacturing method therefor, and filter equipment using same

Ion exchange membrane and filter module using same

Waterproof sound transmitting sheet, and method for producing same

SAMSUNG ELECTRO MECH

Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the same

Cap wafer, semiconductor chip having the same, and fabrication method thereof

KIM DONG-KYUN

Piezoelectric micro speaker with curved lead wires and method of manufacturing the same

Piezoelectric micro speaker

HYUNDAI TRANSYS INC

Locking device for walk-in seat of vehicle

Device for preventing rotation of vehicle seat rail

LG DISPLAY CO LTD

Backplate and foldable display device including the same

HWANG JUN-SIK

Piezoelectric micro speaker having piston diaphragm and method of manufacturing the same

CHUNG SEOK-WHAN

Piezoelectric micro speaker including weight attached to vibrating membrane and method of manufacturing the same

GEN ELECTRIC

Methods for determining proximity of a mobile device and an appliance and for operating the same

KOREA ELECTRONICS TELECOMM

Fabrication method of high temperature superconducting step-edge Josephson junction

JEONG BYUNG-GIL

Piezoelectric micro speaker including annular ring-shaped vibrating membranes and method of manufacturing the piezoelectric micro speaker