P

Inventor

ICHIROKU NOBUHIRO

JP18 patents
⚠️ This page may combine multiple inventors who share the name “ICHIROKU NOBUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINETSU CHEMICAL CO

17 patents
US7026382B2Apr 11, 2006

Conductive resin composition

SHINETSU CHEMICAL CO47 citations92
US6117953ASep 12, 2000

Liquid epoxy resin composition for ball grid array package

SHINETSU CHEMICAL CO19 citations92
US7244495B2Jul 17, 2007

Dicing/die bonding adhesion tape

SHINETSU CHEMICAL CO10 citations84
US7488539B2Feb 10, 2009

Adhesive composition and sheet having an adhesive layer of the composition

SHINETSU CHEMICAL CO17 citations83
US7147920B2Dec 12, 2006

Wafer dicing/die bonding sheet

SHINETSU CHEMICAL CO18 citations83
US6645632B2Nov 11, 2003

Film-type adhesive for electronic components, and electronic components bonded therewith

SHINETSU CHEMICAL CO15 citations83
US6949619B2Sep 27, 2005

Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition

SHINETSU CHEMICAL CO11 citations73
US6808819B2Oct 26, 2004

Heat resistant resin composition and adhesive film

SHINETSU CHEMICAL CO7 citations73
US6506822B2Jan 14, 2003

Epoxy resin composition

SHINETSU CHEMICAL CO12 citations73
US5473091ADec 5, 1995

Quaternary phosphorus compounds and their preparation

SHINETSU CHEMICAL CO4 citations63
US10704008B2Jul 7, 2020

Heat-conductive silicone grease composition

SHINETSU CHEMICAL CO1 citations62
US7820742B2Oct 26, 2010

Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C

SHINETSU CHEMICAL CO4 citations62
US7722949B2May 25, 2010

Adhesive composition and adhesive film therefrom

SHINETSU CHEMICAL CO4 citations62
US7683152B2Mar 23, 2010

Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer

SHINETSU CHEMICAL CO4 citations62
US7364797B2Apr 29, 2008

Adhesive composition and adhesive film

SHINETSU CHEMICAL CO2 citations62
US7060786B2Jun 13, 2006

Heat resistant resin composition and adhesive film

SHINETSU CHEMICAL CO1 citations52
US12584050B2Mar 24, 2026

Adhesive composition and film-shaped sealing material

SHINETSU CHEMICAL CO0 citations47

ICHIROKU NOBUHIRO

1 patent