Inventor
TAI WEI-CHANG
TW5 patents
Patents
5 patentsUS6815833B2Nov 9, 2004
Flip chip package
ADVANCED SEMICONDUCTOR ENG33 citations92
US7473629B2Jan 6, 2009
Substrate structure having a solder mask and a process for making the same
ADVANCED SEMICONDUCTOR ENG30 citations91
US7417329B2Aug 26, 2008
System-in-package structure
ADVANCED SEMICONDUCTOR ENG39 citations91
US7180181B2Feb 20, 2007
Mesh shaped dam mounted on a substrate
ADVANCED SEMICONDUCTOR ENG17 citations82
US7195956B2Mar 27, 2007
Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units
ADVANCED SEMICONDUCTOR ENG0 citations51