Inventor
HUNDT MICHAEL J
US43 patents
⚠️ This page may combine multiple inventors who share the name “HUNDT MICHAEL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SGS THOMSON MICROELECTRONICS
18 patentsUS5642261AJun 24, 1997
Ball-grid-array integrated circuit package with solder-connected thermal conductor
SGS THOMSON MICROELECTRONICS283 citations99
US5557504ASep 17, 1996
Surface mountable integrated circuit package with detachable module
SGS THOMSON MICROELECTRONICS76 citations96
US5283717AFeb 1, 1994
Circuit assembly having interposer lead frame
SGS THOMSON MICROELECTRONICS96 citations96
US5196374AMar 23, 1993
Integrated circuit package with molded cell
SGS THOMSON MICROELECTRONICS72 citations96
US5677247AOct 14, 1997
Low-profile socketed packaging system with land-grid array and thermally conductive slug
SGS THOMSON MICROELECTRONICS18 citations93
US5461257AOct 24, 1995
Integrated circuit package with flat-topped heat sink
SGS THOMSON MICROELECTRONICS29 citations93
US5294829AMar 15, 1994
IC package having direct attach backup battery
SGS THOMSON MICROELECTRONICS34 citations93
US5289034AFeb 22, 1994
IC package having replaceable backup battery
SGS THOMSON MICROELECTRONICS28 citations93
US5124782AJun 23, 1992
Integrated circuit package with molded cell
SGS THOMSON MICROELECTRONICS50 citations93
US5693572ADec 2, 1997
Ball grid array integrated circuit package with high thermal conductivity
SGS THOMSON MICROELECTRONICS44 citations92
US5451715ASep 19, 1995
Molded package integrated circuit with electrochemical cell
SGS THOMSON MICROELECTRONICS27 citations92
US5570273AOct 29, 1996
Surface mountable integrated circuit package with low-profile detachable module
SGS THOMSON MICROELECTRONICS47 citations91
US5498903AMar 12, 1996
Surface mountable integrated circuit package with integrated battery mount
SGS THOMSON MICROELECTRONICS21 citations89
US5403782AApr 4, 1995
Surface mountable integrated circuit package with integrated battery mount
SGS THOMSON MICROELECTRONICS40 citations89
US5610800AMar 11, 1997
Substrate mounting of circuit components with a low profile
SGS THOMSON MICROELECTRONICS18 citations84
US5489752AFeb 6, 1996
Process for dissipating heat from a semiconductor package
SGS THOMSON MICROELECTRONICS16 citations81
US5711069AJan 27, 1998
Method of making an integrated circuit package with flat-topped heat sink
SGS THOMSON MICROELECTRONICS8 citations74
US5491889AFeb 20, 1996
Apparatus for achieving printed circuit board planarity
SGS THOMSON MICROELECTRONICS2 citations62
ST MICROELECTRONICS INC
16 patentsUS6028773AFeb 22, 2000
Packaging for silicon sensors
ST MICROELECTRONICS INC178 citations99
US5991156ANov 23, 1999
Ball grid array integrated circuit package with high thermal conductivity
ST MICROELECTRONICS INC112 citations98
US7244967B2Jul 17, 2007
Apparatus and method for attaching an integrating circuit sensor to a substrate
ST MICROELECTRONICS INC52 citations96
US5805419ASep 8, 1998
Low-profile socketed packaging system with land-grid array and thermally conductive slug
ST MICROELECTRONICS INC70 citations96
US6113399ASep 5, 2000
Low-profile socketed packaging system with land-grid array and thermally conductive slug
ST MICROELECTRONICS INC19 citations93
US6686227B2Feb 3, 2004
Method and system for exposed die molding for integrated circuit packaging
ST MICROELECTRONICS INC20 citations92
US7304362B2Dec 4, 2007
Molded integrated circuit package with exposed active area
ST MICROELECTRONICS INC15 citations84
US7315079B2Jan 1, 2008
Thermally-enhanced ball grid array package structure and method
ST MICROELECTRONICS INC7 citations74
US6817854B2Nov 16, 2004
Mold with compensating base
ST MICROELECTRONICS INC8 citations74
US6815262B2Nov 9, 2004
Apparatus and method for attaching an integrated circuit sensor to a substrate
ST MICROELECTRONICS INC9 citations74
US6372543B1Apr 16, 2002
Wrap-around interconnect for fine pitch ball grid array
ST MICROELECTRONICS INC10 citations72
US6121678ASep 19, 2000
Wrap-around interconnect for fine pitch ball grid array
ST MICROELECTRONICS INC15 citations72
US7402454B2Jul 22, 2008
Molded integrated circuit package with exposed active area
ST MICROELECTRONICS INC3 citations63
US7180175B2Feb 20, 2007
Thermally-enhanced ball grid array package structure and method
ST MICROELECTRONICS INC2 citations63
US6586821B1Jul 1, 2003
Lead-frame forming for improved thermal performance
ST MICROELECTRONICS INC3 citations63
US9012264B2Apr 21, 2015
Integrated circuit package including embedded thin-film battery
ST MICROELECTRONICS INC1 citations49
SGS THOMSON MICROELECTRONICS INC
6 patentsUSD359028SJun 6, 1995
Socketed integrated circuit package
SGS THOMSON MICROELECTRONICS INC57 citations95
USD358806SMay 30, 1995
Socketed integrated circuit package
SGS THOMSON MICROELECTRONICS INC41 citations92
USD358805SMay 30, 1995
Detachable integrated circuit module
SGS THOMSON MICROELECTRONICS INC7 citations73
USD358804SMay 30, 1995
Detachable integrated circuit module
SGS THOMSON MICROELECTRONICS INC5 citations62
USD354275SJan 10, 1995
Low-profile detachable integrated circuit module
SGS THOMSON MICROELECTRONICS INC3 citations61
USD354274SJan 10, 1995
Low-profile detachable integrated circuit module
SGS THOMSON MICROELECTRONICS INC1 citations50