Inventor
LANDAU STEFAN
DE22 patents
⚠️ This page may combine multiple inventors who share the name “LANDAU STEFAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LANDAU STEFAN
7 patentsUS9147649B2Sep 29, 2015
Multi-chip module
LANDAU STEFAN9 citations82
US8129225B2Mar 6, 2012
Method of manufacturing an integrated circuit module
LANDAU STEFAN7 citations82
US8097944B2Jan 17, 2012
Semiconductor device
LANDAU STEFAN2 citations61
US8253241B2Aug 28, 2012
Electronic module
LANDAU STEFAN2 citations59
US8687370B2Apr 1, 2014
Housing for a chip arrangement and a method for forming a housing
LANDAU STEFAN1 citations51
US8097959B2Jan 17, 2012
Semiconductor device including first and second carriers
LANDAU STEFAN1 citations50
US8836113B2Sep 16, 2014
Electronic module
LANDAU STEFAN0 citations48
INFINEON TECHNOLOGIES AG
6 patentsUS7479691B2Jan 20, 2009
Power semiconductor module having surface-mountable flat external contacts and method for producing the same
INFINEON TECHNOLOGIES AG31 citations92
US7955954B2Jun 7, 2011
Method of making semiconductor devices employing first and second carriers
INFINEON TECHNOLOGIES AG5 citations72
US9142739B2Sep 22, 2015
Method and system for providing a reliable light emitting diode semiconductor device
INFINEON TECHNOLOGIES AG2 citations62
US7667337B2Feb 23, 2010
Semiconductor device with conductive die attach material
INFINEON TECHNOLOGIES AG2 citations61
US7955901B2Jun 7, 2011
Method for producing a power semiconductor module comprising surface-mountable flat external contacts
INFINEON TECHNOLOGIES AG6 citations59
US10020245B2Jul 10, 2018
Laminate electronic device
INFINEON TECHNOLOGIES AG1 citations52