Inventor

MAHLER JOACHIM

DE203 patents

⚠️ This page may combine multiple inventors who share the name “MAHLER JOACHIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAHLER JOACHIM

INFINEON TECHNOLOGIES AG

Device including two power semiconductor chips and manufacturing thereof

Method for forming electronic components

Semiconductor device including electronic component coupled to a backside of a chip

Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material

Semiconductor device having a sensor chip, and method for producing the same

Sensor component with a cavity housing and a sensor chip and method for producing the same

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

Semiconductor component and sensor component for data transmission devices

Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boards

Printed circuit boards and methods of manufacturing thereof

Chip package with passives

Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device

Semiconductor device

Semiconductor module with at least two substrates

Power semiconductor device in lead frame employing connecting element with conductive film

Method of manufacturing a semiconductor device including etching to etch stop regions

Semiconductor device with parylene coating

Electronic device and method of manufacturing same

Semiconductor device having an adhesion promoting layer and method for producing it

Semiconductor module having discrete components and method for producing the same

Curing layers of a semiconductor product using electromagnetic fields

Semiconductor component including semiconductor chip and method for producing the same

Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same

Semiconductor device with semiconductor chip and method for producing it

Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same

Integrated circuit component with passivation layer

Electronic module with layer of adhesive and process for producing it

Electronic device

Integrated circuit including gas phase deposited packaging material

Semiconductor device with semiconductor device components embedded in a plastic housing composition

Semiconductor device with semiconductor device components embedded in plastic package compound

Chip arrangement and method for producing a chip arrangement

MAHLER JOACHIM

Electric device package comprising a laminate and method of making an electric device package comprising a laminate

Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package

Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material

Multichip power semiconductor device

Integrated circuit device and method for the production thereof

EWE HENRIK

Laminate electronic device

Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts

LANDAU STEFAN

Multi-chip module

Method of manufacturing an integrated circuit module

INFINEON TECHNOLOGIES AUSTRIA

Multichip device

OTREMBA RALF

Device including two power semiconductor chips and manufacturing thereof

HOSSEINI KHALIL

Device including two power semiconductor chips and manufacturing thereof

FUERGUT EDWARD

Semiconductor package and methods of formation thereof

NIKITIN IVAN

Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device

KALZ FRANZ-PETER

Micromechanical semiconductor sensing device

HENRIK EWE

Laminate electronic device