Inventor
BROWNELL MICHAEL
US20 patents
⚠️ This page may combine multiple inventors who share the name “BROWNELL MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS5990552ANov 23, 1999
Apparatus for attaching a heat sink to the back side of a flip chip package
INTEL CORP105 citations98
US6016006AJan 18, 2000
Thermal grease insertion and retention
INTEL CORP56 citations95
US5699227ADec 16, 1997
Heat pipe to baseplate attachment method
INTEL CORP42 citations95
US6166908ADec 26, 2000
Integrated circuit cartridge
INTEL CORP84 citations94
US5949647ASep 7, 1999
Heat pipe to baseplate attachment method
INTEL CORP37 citations92
US5802707ASep 8, 1998
Controlled bondline thickness attachment mechanism
INTEL CORP21 citations90
US5956229ASep 21, 1999
Injection molded thermal interface system
INTEL CORP8 citations72
US6349465B1Feb 26, 2002
Controlled bondline thickness attachment mechanism
INTEL CORP8 citations71