Inventor

LEE HEE KON

KR4 patents

⚠️ This page may combine multiple inventors who share the name “LEE HEE KON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK SEUNG WOOK

2 patents

US8704350B2Apr 22, 2014

Stacked wafer level package and method of manufacturing the same

PARK SEUNG WOOK11 citations82

US8658467B2Feb 25, 2014

Method of manufacturing stacked wafer level package

PARK SEUNG WOOK7 citations81

KIM JIN GU

1 patent

US8830689B2Sep 9, 2014

Interposer-embedded printed circuit board

KIM JIN GU19 citations82

SAMSUNG ELECTRO MECH

1 patent

US7947530B2May 24, 2011

Method of manufacturing wafer level package including coating and removing resin over the dicing lines

SAMSUNG ELECTRO MECH5 citations62