Inventor

KO FRANCIS

TW16 patents

⚠️ This page may combine multiple inventors who share the name “KO FRANCIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

6 patents

US7974728B2Jul 5, 2011

System for extraction of key process parameters from fault detection classification to enable wafer prediction

TAIWAN SEMICONDUCTOR MFG51 citations97

US7144297B2Dec 5, 2006

System and method for enhanced control of copper trench sheet resistance uniformity

TAIWAN SEMICONDUCTOR MFG4 citations61

US7642100B2Jan 5, 2010

Method and system for yield and productivity improvements in semiconductor processing

TAIWAN SEMICONDUCTOR MFG4 citations61

LAM RES CORP

4 patents

US7160671B2Jan 9, 2007

Method for argon plasma induced ultraviolet light curing step for increasing silicon-containing photoresist selectivity

LAM RES CORP19 citations91

US6541361B2Apr 1, 2003

Plasma enhanced method for increasing silicon-containing photoresist selectivity

LAM RES CORP17 citations89

US6559049B2May 6, 2003

All dual damascene oxide etch process steps in one confined plasma chamber

LAM RES CORP24 citations88

US6799907B2Oct 5, 2004

Plasma enhanced method for increasing silicon-containing photoresist selectivity

LAM RES CORP0 citations48

KO FRANCIS

4 patents

US8682466B2Mar 25, 2014

Automatic virtual metrology for semiconductor wafer result prediction

KO FRANCIS13 citations81

US8716867B2May 6, 2014

Forming interconnect structures using pre-ink-printed sheets

KO FRANCIS3 citations61

US8409993B2Apr 2, 2013

Method and system for controlling copper chemical mechanical polish uniformity

KO FRANCIS2 citations61

US9037279B2May 19, 2015

Clustering for prediction models in process control and for optimal dispatching

KO FRANCIS1 citations51

LIN CHUN-HSIEN

1 patent

US8145337B2Mar 27, 2012

Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment

LIN CHUN-HSIEN11 citations82

WANG AMY

1 patent

US8433434B2Apr 30, 2013

Near non-adaptive virtual metrology and chamber control

WANG AMY6 citations78

KO FRANCIS

TAIWAN SEMICONDUCTOR MFG

System for extraction of key process parameters from fault detection classification to enable wafer prediction

Method and apparatus to enable accurate wafer prediction

Prediction of uniformity of a wafer

Auto routing for optimal uniformity control

System and method for enhanced control of copper trench sheet resistance uniformity

Method and system for yield and productivity improvements in semiconductor processing

LAM RES CORP

Method for argon plasma induced ultraviolet light curing step for increasing silicon-containing photoresist selectivity

Plasma enhanced method for increasing silicon-containing photoresist selectivity

All dual damascene oxide etch process steps in one confined plasma chamber

Plasma enhanced method for increasing silicon-containing photoresist selectivity

KO FRANCIS

Automatic virtual metrology for semiconductor wafer result prediction

Forming interconnect structures using pre-ink-printed sheets

Method and system for controlling copper chemical mechanical polish uniformity

Clustering for prediction models in process control and for optimal dispatching

LIN CHUN-HSIEN

Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment

WANG AMY

Near non-adaptive virtual metrology and chamber control