Inventor · disambiguated record
Bruce Wachtmann
Also filed as: WACHTMANN BRUCE · WACHTMANN BRUCE K
6 granted patents·4 pending applications·142 citations·filing 2002–2007
83Inventor score
Top patents by PatentIndex Score
10 records- 0192US6936918B2MEMS device with conductive path through substrateANALOG DEVICES INC·Filed 2004·Granted Aug 30, 2005·78 cites·23 claims
- 0287US7034393B2Semiconductor assembly with conductive rim and method of producing the sameANALOG DEVICES INC·Filed 2003·Granted Apr 25, 2006·47 cites·18 claims
- 0366US6964894B2Apparatus and method of forming a device layerANALOG DEVICES INC·Filed 2003·Granted Nov 15, 2005·13 cites·15 claims
- 0443US2006118946A1Semiconductor assembly with conductive rim and method of producing the sameALIE SUSAN A·Filed 2005·Application pending·0 cites
- 0541US6956274B2TiW platinum interconnect and method of making the sameANALOG DEVICES INC·Filed 2002·Granted Oct 18, 2005·1 cites·15 claims
- 0641US6878626B1TiW platinum interconnect and method of making the sameANALOG DEVICES INC·Filed 2002·Granted Apr 12, 2005·1 cites·10 claims
- 0741US2007207562A1Method of Forming a Micromachined Device Using an Assisted ReleaseANALOG DEVICES INC·Filed 2007·Application pending·0 cites
- 0840US7906359B2Method of forming a surface micromachined MEMS deviceANALOG DEVICES INC·Filed 2003·Granted Mar 15, 2011·2 cites·13 claims
- 0939US2005170609A1Conductive bond for through-wafer interconnectFiled 2005·Application pending·0 cites
- 1033US2004104444A1MEMS device with alternative electrical connectionsWACHTMANN BRUCE K·Filed 2002·Application pending·0 cites
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