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Inventor
ISHIHARA AKIHIDE
JP
2 patents
Patents
2 patents
US7812261B2
Oct 12, 2010
Multilayer printed wiring board and test body for printed wiring board
IBIDEN CO LTD
5 citations
58
US12232268B2
Feb 18, 2025
Wiring substrate and method for manufacturing wiring substrate
IBIDEN CO LTD
0 citations
43