Inventor

LEE HEE-SEOK

KR54 patents

⚠️ This page may combine multiple inventors who share the name “LEE HEE-SEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HEE-SEOK

SAMSUNG ELECTRONICS CO LTD

Semiconductor package including transformer or antenna

Input and output driver circuits for differential signal transfer, and differential signal transfer apparatus and methods

Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer

Semiconductor package

Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Semiconductor chip having coolant path, semiconductor package and package cooling system using the same

Multi-chip package including at least one semiconductor device enclosed therein

Printed circuit board having a bond wire shield structure for a signal transmission line

Semiconductor package with conductive molding compound and manufacturing method thereof

Semiconductor device package and apparatus comprising the same

Semiconductor package

Semiconductor package preventing generation of static electricity therein

Semiconductor package

Substrate for semiconductor package

Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Semiconductor chip package

Semiconductor package with thermal dissipating member and method of manufacturing the same

Source driver, an image display assembly and an image display apparatus

Flip chip packages

Tape distribution substrate having pattern for reducing EMI

Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip

Substrate for semiconductor package

QUALCOMM INC

Simultaneous object detection and rigid transform estimation using neural network

Lane marker detection and lane instance recognition

Bounding box estimation and object detection

Method and device for capturing image of traffic sign

Bounding box estimation and object detection

Lane marker recognition

Lane marker detection

Efficient dropout inference for bayesian deep learning

Text-based image resizing

Activating flash for capturing images with text

KIM YONG-HOON

Semiconductor package

Stacked package structure including insulating layer between two stacked packages

Semiconductor device including shielding layer and fabrication method thereof

Embedded chip-on-chip package and package-on-package comprising same

Semiconductor package

Package on package structure

SONG EUN-SEOK

Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same

Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same

Semiconductor package to remove power noise using ground impedance

CHOI YUN-SEOK

Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package

Interconnection substrate, semiconductor chip package including the same, and display system including the same

UNIV CHUNG ANG IND

Cyclic pentadepsipeptide derivative and fusarium strain producing the same

Cyclic pentadepsipeptides and microorganism of Fusarium strain producing the same

SONG EUN SEOK

Semiconductor package including power ball matrix and power ring having improved power integrity

CHUNG YE-CHUNG

Source driver, an image display assembly and an image display apparatus

PARK JI-YONG

Electronic device having interconnections, openings, and pads having greater width than the openings

LEE JIN-HO

Stack type semiconductor package